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Assessment of New Relation for the Elastic Compliance of a Film-Substrate System

Published online by Cambridge University Press:  21 March 2011

Andrei Rar ,
H. Song  and
G.M. Pharr
Andrei Rar
Affiliation:
The University of Tennessee, Department of Materials Science & Engineering, Knoxville, TN Oak Ridge National Laboratory, Metals and Ceramics Division, Oak Ridge, TN
H. Song
Affiliation:
Licenergy Corp., Houston, TX.
G.M. Pharr
Affiliation:
The University of Tennessee, Department of Materials Science & Engineering, Knoxville, TN Oak Ridge National Laboratory, Metals and Ceramics Division, Oak Ridge, TN
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Abstract

A new closed-form relation for the elastic compliance of a film-substrate system indented by a flat cylindrical punch is presented. The relation is an extension of the work of Gao at al. [1] modified to increase the applicable range of modulus mismatch between the film and substrate. The accuracy of the relation is assessed by comparison to finite element simulations, other approximate numerical solutions, and nanoindentation experiments performed on a fluorinated silicate glass (FSG) film on a silicon substrate. The benefits and limitations of the relation are discussed.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 695: Symposium L – Thin Films: Stresses and Mechanical Properties IX , 2001 , L10.10.1
Copyright
Copyright © Materials Research Society 2002

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References

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