Hostname: page-component-76fb5796d-5g6vh Total loading time: 0 Render date: 2024-04-25T14:54:02.579Z Has data issue: false hasContentIssue false

Antiferroelectric Thin Films for Decoupling Capacitor and Microactuator Applications

Published online by Cambridge University Press:  10 February 2011

Baomin Xu
Affiliation:
Intercollege Materials Research Laboratory, Pennsylvania State University, University Park, PA 16802
Neelesh G. Pai
Affiliation:
Intercollege Materials Research Laboratory, Pennsylvania State University, University Park, PA 16802
Paul Moses
Affiliation:
Intercollege Materials Research Laboratory, Pennsylvania State University, University Park, PA 16802
L. Eric Cross
Affiliation:
Intercollege Materials Research Laboratory, Pennsylvania State University, University Park, PA 16802
Get access

Abstract

Lanthanum-doped or niobium-doped lead zirconate titanate stannate antiferroelectric thin films with the thickness of about 0.4 μm have been prepared from acetic acid-based or 2-methoxyethanol-based sol-gel method. All the films have the maximum polarization larger than 30 μC/cm2 and show zero remanent polarization. By choosing appropriate compositions, we can make the films have “square” hysteresis loops with very sharp phase transition or “slanted” hysteresis loops with very small hysteresis. The properties that are important for decoupling capacitor and microactuator applications are characterized. For decoupling capacitor applications, films having square hysteresis loops with energy storage density of up to 7 J/cm3 can be made, which release more than half of their stored charge in 10 ns with a maximum current density of more than 9400 A/cm2. For microactuator applications, the films can either have a strain level of 0.32% with very small hysteresis or have a strain level of 0.42% with moderate hysteresis.

Type
Research Article
Copyright
Copyright © Materials Research Society 1998

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Jaffe, B., Proc. IRE, 49, 1264 (1961).Google Scholar
2. Berlincourt, D., IEEE Trans. Sonics. Ultrason., 13, 116 (1966).Google Scholar
3. Pan, W. Y., Dam, C. Q., Zhang, Q. M., and Cross, L. E., J. Appl. Phys., 66, 6014 (1989).Google Scholar
4. Markowski, K., Park, S. E., Yoshikawa, S., and Cross, L. E., J. Am. Ceram. Soc, 79, 3297 (1996).Google Scholar
5. Brooks, K. G., Chen, J., Udayakumar, K. R., and Cross, L. E., J. Appl. Phys., 75, 1699 (1994).Google Scholar
6. Li, K. G., Wang, F., and Haerting, G. H., J. Mat. Sci., 30, 1386 (1995).Google Scholar
7. Sengupta, S. S., Roberts, D., Li, J. F., Kim, M. C., and Payne, D. A., J. Appl. Phys., 78, 1171 (1995).Google Scholar
8. Gaskey, C. J., Udayakumar, K. R., Chen, H. D., and Cross, L. E., J. Mat. Res., 10, 2764 (1995).Google Scholar
9. Fatuzzo, E. and Merz, W. J., Phys. Rev., 116, 61 (1959).Google Scholar
10. Pan, W. Y., Gu, W. Y., and Cross, L. E., Ferroelectrics, 99, 185 (1989).Google Scholar
11. Zhang, Q. M., Pan, W. Y., and Cross, L. E., J. Appl. Phys., 63, 2492 (1988).Google Scholar
12. Pan, W. Y. and Cross, L. E., Rev. Sci. Instrum., 60, 2701 (1989).Google Scholar