The influence of anodic and cathodic pre-treatment on boron doped diamond (BDD) surface for copper (Cu) electrodeposition was studied to assess Cu particle consolidation on BDD electrode. These modified electrodes were applied to study the nitrate electrochemical reduction process. The obtained results showed that the BDD surface cathodically treated presented high Cu particle density as well as even distribution on the electrode surface after the electrodeposition process. For samples anodically treated the electrodeposited Cu was dispersed with lower particle density. This behavior was attributed to a high electrode conductivity imposed by the cathodic pre-treatment leading to an increase in the BDD surface hydrogenation. Therefore, one can conclude that for electrochemical nitrate reduction the anodically treated BDD has a better reproducibility. This response is attributed to the Cu particle consolidation on BDD electrode due to the oxygen surface terminations induced by the anodic pretreatment.