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An Overview of Materials Science in Printed Circuit Packaging

Published online by Cambridge University Press:  22 February 2011

D. P. Seraphim ,
L. C. Lee ,
B. K. Appelt  and
L. L. Marsh
D. P. Seraphim
Affiliation:
IBM Corporation, Systems Technology Division, Endicott, New York 13760
L. C. Lee
Affiliation:
IBM Corporation, Systems Technology Division, Endicott, New York 13760
B. K. Appelt
Affiliation:
IBM Corporation, Systems Technology Division, Endicott, New York 13760
L. L. Marsh
Affiliation:
IBM Corporation, Systems Technology Division, Endicott, New York 13760
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Abstract

A brief description of a set of processes and materials to make printed circuit panels will be given. Then we will discuss the multi-disciplines required for forming a scientific base and provide examples where the fundamentalist and often times specialist is providing the scientific data needed by the packaging engineer. Control techniques, characterization or otherwise basic information helpful in decision making is provided to the development and production groups. Specifically, the state of resin cure at critical steps in the process is used to demonstrate the inter-relation between cure, flow, and mechanical properties in affecting printed circuit board integrity. Finally, the complex role of moisture solubility and diffusion from the process environment in perturbing the chemical and mechanical state is discussed.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 40: Symposium J – Electronic Packaging Materials Science I , 1984 , 21
Copyright
Copyright © Materials Research Society 1985

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