Hostname: page-component-76fb5796d-dfsvx Total loading time: 0 Render date: 2024-04-26T07:32:59.121Z Has data issue: false hasContentIssue false

Amorphization And Recrystallization Processes In Monocrystaline Beta Silicon Carbide Thin Films

Published online by Cambridge University Press:  26 February 2011

J.A. Edmond
Affiliation:
Department of Materials Engineering, North Carolina State University, Raleigh, NC 27695–7907
S.P. Withrow
Affiliation:
Solid State Division, Oak Ridge National Laboratory, Oak Ridge, TN 37831
H.S. Kong
Affiliation:
Department of Materials Engineering, North Carolina State University, Raleigh, NC 27695–7907
R.F. Davis
Affiliation:
Department of Materials Engineering, North Carolina State University, Raleigh, NC 27695–7907
Get access

Abstract

Individual, as well as multiple doses of 27Al+, 31p+, 28Si+, and 28Si+ plus 12C+ were implanted into (100) oriented monocrystallne β-SiC films+. A critical energy of =16 eV/atom required for the amorphization of β-SiC via implantation of Al and P was determined using the TRIM84 computer program for calculation of damage-energy profiles coupled with results of RBS/ion channeling analyses. In order to recrystallize amorphized layers created by the individual implantation of all four ion species, thermal annealing at 1600, 1700, or 1800°C was employed. Characterization of the recrystallized layers was performed using XTEM. Examples of SPE regrown layers containing; 1) precipitates and dislocation loops, 2) highly faulted, microtwinned regions, and 3) random crystallites were observed.

Type
Research Article
Copyright
Copyright © Materials Research Society 1985

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

[1] Hart, R.R., Dunlap, H.L., and Marsh, O.J., Rad. Effects 9, 261 (1971).CrossRefGoogle Scholar
[2] Williams, J.M., McHargue, C.J., and Appleton, B.R., Nucl. Instr. and Meth. 209/210,317 (1983).Google Scholar
[3] Manning, I. and Mueller, G.P., Comp. Phys. Comm. 7, 85 (1974).Google Scholar
[4] Biersack, J.P. and Haggmark, L. G., Nucl. Instr. and Meth. 174, 257 (1980).Google Scholar
[5] Dennis, J.R. and Hale, E.B., J. Appl. Phys. 49, 1119 (1978).Google Scholar
[6] Donnelly, J.P., Nucl. Instr, and Meth. 182/183, 553 (1981).Google Scholar
[7] Christel, L.A. and Gibbons, J.F., J. Appl. Phys. 52, 5050 (1981).Google Scholar
[8] Liaw, H.P. and Davis, R.F., J. Electrochem. Soc. 132, 642 (1985).Google Scholar
[9] Biersack, J.P. and Eckstein, W., J. Appl. Phys. A34, 73 (1984).Google Scholar
[10] Edmond, J.A., Kim, H.J., and Davis, R.F., to be published in 1985 MRS Symposia Proceedings on Rapid Thermal Processing, Boston, MA 1985.Google Scholar
[11] Carter, C.H. Jr, Edmond, J.A., Palmour, J.W., Ryu, J., Kim, H.J., and Davis, R.F., to be published in MRS Symposia Proceedings on Microscopic Identification of Electronic Defects in Semiconductors, San Francisco, CA, 1985.Google Scholar
[12] Maszara, W., Rozgonyi, G.A., Simps-n, L., and Wortman, J.J., to be published in 1985 MRS Symposia Proceedings on Beam-Solid Interactions and Phase Transformations, Boston, MA, 1985.Google Scholar