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Aluminum/Copper Nanocomposites Fabricated by The Jet Vapor Depositiontm Process

Published online by Cambridge University Press:  15 February 2011

Rebecca L. Lankey ,
L.M. Hsiung ,
H.N.G. Wadley ,
S.M. Karecki ,
D.T. Smith ,
B.L. Halpern  and
J.J. Schmitt
Rebecca L. Lankey
Affiliation:
Department of Materials Science and Engineering, School of Engineering, Thornton Hall, University of Virginia, Charlottesville, VA 22903-2442
L.M. Hsiung
Affiliation:
Department of Materials Science and Engineering, School of Engineering, Thornton Hall, University of Virginia, Charlottesville, VA 22903-2442
H.N.G. Wadley
Affiliation:
Department of Materials Science and Engineering, School of Engineering, Thornton Hall, University of Virginia, Charlottesville, VA 22903-2442
S.M. Karecki
Affiliation:
Jet Process Corporation, 24 Science Park, New Haven, CT 06511
D.T. Smith
Affiliation:
Ceramics Division, National Institute of Standards and Technology, Bldg. 223, Room A329, Gaithersburg, MD 20899
B.L. Halpern
Affiliation:
Jet Process Corporation, 24 Science Park, New Haven, CT 06511
J.J. Schmitt
Affiliation:
Jet Process Corporation, 24 Science Park, New Haven, CT 06511
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Abstract

Aluminum and copper nanolaminates have been fabricated at Jet Process Corporation using the novel, proprietary Jet Vapor DepositionTM (JVD)TM process. Laminates with a total thickness of 10 μm were made by depositing alternating layers ofapproximately equal thicknesses of copper and aluminum onto preheated silicon wafers at asubstrate temperature of ∼140 °C. The layer thicknesses were systematicallyvaried between 20 nm and 1 μm. The microstructure and properties of the laminates were investigated using transmission electron microscopy (TEM), scanning electron microscopy (SEM), and nanoindentation methods. TEM has shown that the laminates have a strong {111} texture. The hardness results show that above a critical layer thickness of approximately 50 nm, the yield strength of the composites varies inversely with thelayer thickness, while the strength of nanolaminates with layer thicknesses smaller than the critical thickness is better explained by the Koehler model. An alternative model recently proposed by Embury and Hirth fits the data equally well.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 382: Symposium G – Structure and Properties of Multilayered Thin Films , 1995 , 113
Copyright
Copyright © Materials Research Society 1995

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References

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