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Al-Oxynitride Buffer Layer Facilities for PrOX/SiC Interfaces

  • Karsten Henkel (a1), Rakesh Sohal (a2), Carola Schwiertz (a3), Yevgen Burkov (a4), Mohamed Torche (a5) and Dieter Schmeißer (a6)...


We investigate the dielectric properties of Praseodymium based oxides and silicates by preparing MIS structures consisting of a metal layer (M), PrOX (praseodymium oxide) as a high-k insulating layer (I), and silicon (Si) or silicon carbide (SiC) as semiconductor substrates (S).

The use of a buffer layer between PrOX and SiC is necessary as we found destructive interactions like silicate and graphite formation between these materials. Based on a higher permittivity value than SiO2 and a good lattice matching in conjunction with nearly the same thermal expansion coefficient to SiC, we focus on aluminum oxynitride (AlON) as a suitable buffer layer for this high-k/wide-bandgap system. We report on results achieved by Synchrotron Radiation Photoemission Spectroscopy (SRPES) and by electrical measurements.

In our spectroscopic investigations we found a stable AlON/3C-SiC interface as well as no elemental carbon and silicate contributions in the core levels after thin PrOX deposition and annealing up to 900°C.

In electrical characterizations of PrOX/AlON stacks on silicon we already found a strong improvement in the leakage current down to values of 10-7 A/cm2 at an CET of 4nm. We observed an interface state density in the range of 5x1011-1x1012/eVcm2 and 1-5x1012/eVcm2 on Si and SiC, respectively.



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