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Adhesion Study in Aluminum/Polyimide System

Published online by Cambridge University Press:  10 February 2011

S. H. Yoo ,
S. J. Heo ,
Y.-H. Kim ,
B. J. Han  and
J. H. Yoon
S. H. Yoo
Affiliation:
Dept. of Materials Engineering, Hanyang University, 17 Haengdang-dong, Seongdong-ku, Seoul, Korea
S. J. Heo
Affiliation:
Dept. of Materials Engineering, Hanyang University, 17 Haengdang-dong, Seongdong-ku, Seoul, Korea
Y.-H. Kim
Affiliation:
Dept. of Materials Engineering, Hanyang University, 17 Haengdang-dong, Seongdong-ku, Seoul, Korea
B. J. Han
Affiliation:
Semiconductor Inc, Seoul, Korea
J. H. Yoon
Affiliation:
Semiconductor Inc, Seoul, Korea
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Abstract

The effects of RF plasma precleaning and polyimide curing conditions on the peel strength have been studied. polyimide precursors of BG-2480 (Toray) and PI-2611 (Du Pont) were spincoated and cured under the various conditions. Cured polyimide substrates were in-situ Ar+ RF plasma cleaned prior to metal deposition. Al-2%Si or Al-0.5%Cu-1%Si thin films were deposited onto polyimide substrates using DC magnetron sputtering.

The peel strength was enhanced by RF plasma treatment. The Al/modified PI specimen failed cohesively in the polyimide. The polyimide curing condition strongly affects the peel strength in the Al/modified PI system.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 511: Symposium E – Low Dielectric Constant Materials IV , 1998 , 377
Copyright
Copyright © Materials Research Society 1998

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References

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