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Adhesion Strength and Deformation Behavior of Al(Cu-Si)/BPDA-PDA Layered Structures

Published online by Cambridge University Press:  15 February 2011

P. Abramowitz ,
E. Ogawa ,
P. S. Ho  and
J. Wetzel
P. Abramowitz
Affiliation:
Center of Materials Science & Engineering, University of Texas, Austin, TX 78712
E. Ogawa
Affiliation:
Center of Materials Science & Engineering, University of Texas, Austin, TX 78712
P. S. Ho
Affiliation:
Center of Materials Science & Engineering, University of Texas, Austin, TX 78712
J. Wetzel
Affiliation:
Motorola, Inc., Advanced Materials Group, Austin, Tx 78721
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Abstract

The adhesion of Al(Cu-Si) line structures on thin films of BPDA-PDA with different surface preconditioning were examined by measuring the deformation energy of the metal and interface. The properties of BPDA-PDA/Al(Cu-Si) were examined with atomic force microscopy (AFM). Although different sputtering treatments profoundly affect the adhesive properties, the sputtering does not appreciably change the topology of the BPDA-PDA. We also found evidence that even though the thickness of the interface can be very small (3–5 nm), the polymer/metal interface can greatly affect the deformation behavior of the entire system.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 476: Symposium N – Low-Dielectric Constant Materials III , 1997 , 285
Copyright
Copyright © Materials Research Society 1997

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References

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