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Adhesion Properties of Metallic and Oxide Thin Films Produced by Several Methods

Published online by Cambridge University Press:  15 February 2011

C. Ottermann ,
N. Tadokoro ,
Y. Tomita  and
K. Bange
C. Ottermann
Affiliation:
Schott Glaswerke, Research & Development, 6500 Mainz, Germany
N. Tadokoro
Affiliation:
HOYA Corporation, Research & Development, Tokyo 196, Japan
Y. Tomita
Affiliation:
HOYA Corporation, Research & Development, Tokyo 196, Japan
K. Bange
Affiliation:
Schott Glaswerke, Research & Development, 6500 Mainz, Germany
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Abstract

Adhesion of Cr, SiO2, TiO2 and Ta2O5 films with thicknesses between 40 nm and 380 nm has been investigated using a new scratch-test method based on a vibrating diamond micro-indenter. The oxide films are produced on different substrates by sol-gel technique (SG), reactive evaporation (RE), reactive ion plating (IP) and plasma impulse chemical vapor deposition (PICVD); Cr-layers are deposited by sputtering (SP) on quartz. Large variations in adhesion are found for different coating techniques and deposition conditions, especially the substrate temperature. The adhesion can be correlated with microscopic properties in the film-substrate interface where differences are analyzed in term of hydrogen content, film growth and density. The adhesion is also connected with other macroscopic film quantities.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 308: Symposium M1 – Thin Films: Stresses and Mechanical Properties IV , 1993 , 627
Copyright
Copyright © Materials Research Society 1993

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References

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