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Adhesion of Polysilicon Microbeams in Controlled Humidity Ambients

Published online by Cambridge University Press:  10 February 2011

M. P. de Boer ,
P. J. Clews ,
B. K. Smith  and
T. A. Michalske
M. P. de Boer
Affiliation:
Dept. 1325, Intelligent Micromachining, Sandia National Laboratories, Albuquerque, NM 87185, mpdebo@sandia.gov, www.mdl.sandia.gov/Micromachine
P. J. Clews
Affiliation:
Dept. 1324, Silicon Processing, Sandia National Laboratories, Albuquerque, NM 87185
B. K. Smith
Affiliation:
Dept. 1324, Silicon Processing, Sandia National Laboratories, Albuquerque, NM 87185
T. A. Michalske
Affiliation:
Dept. 1114, Surface and Interface Science, Sandia National Laboratories, Albuquerque, NM 87185
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Abstract

We characterize in-situ the adhesion of surface micromachined polysilicon beams subject to controlled humidity ambients. Beams were freed by supercritical CO2drying. Consistent adhesion results were obtained using a post-treatment in an oxygen plasma which rendered the microbeams uniformly hydrophilic. Individual beam deformations were measured by optical interferometry after equilibration at a given relative humidity (RH). Validation of each adhesion measurement was accomplished by comparing the deformations with elasticity theory. The data indicates that adhesion increases exponentially with RH from 30% to 95%, with values from 1 mJ/m2 to 50 mJ/m2. Using the Kelvin equation, we show that the data should be independent of RH if a smooth interface is considered. By modeling a rough interface consistent with atomic force microscopy (AFM) data, the exponential trend is satisfactorily explained.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 518: Symposium N – Microelectromechanical Structures for Materials Research , 1998 , 131
Copyright
Copyright © Materials Research Society 1998

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