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Adhesion Between Polyimide Films and A12O3 Substrate

Published online by Cambridge University Press:  15 February 2011

Y. Nakamura ,
Y. Suzuki ,
Y. Watanabe  and
S. Hirayama
Y. Nakamura
Affiliation:
Department of Materials Science and Engineering, National Defense Academy 1-10-20 Hashirimizu, Yokosuka, Kanagawa 239, Japan
Y. Suzuki
Affiliation:
Department of Materials Science and Engineering, National Defense Academy 1-10-20 Hashirimizu, Yokosuka, Kanagawa 239, Japan
Y. Watanabe
Affiliation:
Department of Materials Science and Engineering, National Defense Academy 1-10-20 Hashirimizu, Yokosuka, Kanagawa 239, Japan
S. Hirayama
Affiliation:
Department of Materials Science and Engineering, National Defense Academy 1-10-20 Hashirimizu, Yokosuka, Kanagawa 239, Japan
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Abstract

The adhesive strength of polyimide thin films on an alumina substrate has been studied by the pull test. Polyimide thin films were cured at various temperatures from 300 to 400°C, followed by etching in an oxygen plasma for 3 min. After metallization with chromium and copper, the pull test was carried out. It is found that the adhesive strength increases with an increase of the cure temperature. However the strength deteriorates noticeably at the cure temperature of 400°C. A possible reason for this is the variation of chemical states in the polyimide thin films.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 385: Symposium N – Polymer/Inorganic Interfaces II , 1995 , 91
Copyright
Copyright © Materials Research Society 1995

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References

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