Hostname: page-component-5c6d5d7d68-wbk2r Total loading time: 0 Render date: 2024-08-16T07:45:39.019Z Has data issue: false hasContentIssue false

X-Ray Diffraction Analysis and Modeling of Strain Induced Thermal Cycling in a Thin Aluminum (011) Bicrystal Film

Published online by Cambridge University Press:  21 March 2011

D. E. Nowak
Affiliation:
Cornell University, Department of Materials Science and Engineering, Bard Hall, Ithaca, NY 14853
O. Thomas
Affiliation:
on leave from TECSEN, Universite Aix-Marseille III
S. P. Baker
Affiliation:
Cornell University, Department of Materials Science and Engineering, Bard Hall, Ithaca, NY 14853
E. A. Stach
Affiliation:
National Center for Electron Microscopy, Lawrence Berkeley National Laboratory, Berkeley, CA 94720
K. Balzuweit
Affiliation:
National Center for Electron Microscopy, Lawrence Berkeley National Laboratory, Berkeley, CA 94720
U. Dahmen
Affiliation:
National Center for Electron Microscopy, Lawrence Berkeley National Laboratory, Berkeley, CA 94720
Get access

Abstract

Heteroepitaxial films of aluminum bicrystals grown on silicon provide a model system in which to study plasticity in polycrystalline metal thin films. For the bicrystal films, dislocations are confined to move on two different slip plane orientations because of the orientation of the crystals on the substrate. In-situ transmission electron microscopy (TEM) observations during thermal cycling have shown two threshold temperatures for dislocation motion on cooling. A simple model uses the resolved shear stress on the possible slip planes to explain the TEM observations. Mechanisms responsible for the dislocation behavior are studied in-situ during thermal cycling between room temperature and 450°C with x-ray diffraction. The strains are determined using a sin2(Ψ) analysis at each temperature. Direct comparisons are made between the TEM observations, the model and x-ray diffraction results.

Type
Research Article
Copyright
Copyright © Materials Research Society 2002

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Stach, E.A., Dahmen, U., Minor, A.M., Morris, J.W. Jr, Nix, W.D., in Recent developments in Oxide and Metal Epitaxy--Theory and Experiment, Edited by Yeadon, M. and Auciello, O. (Mat. Res. Soc. Proc. 619, Warrendale PA 2000)Google Scholar
2. Thangaraj, N., Westmacott, K.H., and Dahmen, U., Appl. Phys. Let, 61, p. 37 (1992)Google Scholar
3. Freund, L.B., J. Appl. Mech., 54, p. 553 (1987)Google Scholar
4. Nix, W.D., Met. Trans. A, 20A, p. 2217 (1989)Google Scholar
5. Clemens, B.M. and Bain, J.A., MRS Bulletin, 17, p. 46 (1992)Google Scholar
6. Touloukian, Y.S. and Ho, C.Y., eds., Thermal Expansion Non-Metallic Elements and Alloys, vol. 13, (New York, IFI/Plenum 1975)Google Scholar
7. Touloukian, Y.S. and Ho, C.Y., eds., Thermal Expansion Metallic Elements and Alloys, vol. 12, (New York, IFI/Plenum 1977)Google Scholar
8. Baker, S.P., Keller, R.-M., and Arzt, E., in Thin-Films - Stresses and Mechanical Properties VII, Edited by Cammarata, R.C., Busso, E.P., Nastasi, M., Oliver, W.C., (Mat. Res. Soc. Proc. 505, Warrendale PA 1997)Google Scholar
9. Baker, S.P., Kretschmann, A., and Arzt, E., Acta Mat., 49 p. 2145 (2001)Google Scholar