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Three Dimensional Temperature Uniformity Modeling of a Rapid Thermal Processing Chamber

Published online by Cambridge University Press:  21 February 2011

Karson L. Knutson ,
Stephen A. Campbell  and
Floyd Dunn
Karson L. Knutson
Affiliation:
Univeristy of Minnesota, Department of Electrical Engineering, 200 Union Street, Minneapolis, Mn, 55414.
Stephen A. Campbell
Affiliation:
Univeristy of Minnesota, Department of Electrical Engineering, 200 Union Street, Minneapolis, Mn, 55414.
Floyd Dunn
Affiliation:
AG Associates, 1325 Borregas Avenue, Sunnyvale, CA, 94089.
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Abstract

A 3-dimensional model of an industry standard Rapid Thermal Processing (RTP) chamber (AG Assoc. 4108 Heatpulse) has been created. The chamber consists of a quartz sleeve containing a 200mm wafer surrounded by a polysilicon thermal guard ring. The wafer is heated by tungsten filament lamps which are assumed to radiate according to Boltzmazi' gray-body model. Detailed radiation transfer among ∼4000 finite surfaces is considered as well as Navier-Stokes solution of an energy balance to determine chamber temperature distributions.

Experimental wafer temperature distributions have also been obtained using an 8 inch wafer imbedded with 17 thermocouples and from oxide growth measurements at 700 and 1100 Centigrade respectively. The model predictions are within 1% of the experimental data at both low and high temperatures with the only parameter being the lamp filament temperature. The model is used to demonstrate the ability to examine non-symmetric effects of varying specific chamber properties (i.e. lamp power output, wall reflectivity), as well as transient phenomena.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 303: Symposium G – Rapid Thermal and Integrated Processing II , 1993 , 211
Copyright
Copyright © Materials Research Society 1993

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References

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