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Thin Film Characterization Using the Point-Deflection Method

Published online by Cambridge University Press:  21 March 2011

Ning Tang
Affiliation:
Computational Mechanics Center, Mechanical Engineering Department, University of Wisconsin, Madison, WI 53706, U. S. A.
Roxann L. Engelstad
Affiliation:
Computational Mechanics Center, Mechanical Engineering Department, University of Wisconsin, Madison, WI 53706, U. S. A.
Edward G. Lovell
Affiliation:
Computational Mechanics Center, Mechanical Engineering Department, University of Wisconsin, Madison, WI 53706, U. S. A.
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Abstract

The Point-Deflection Method is a potentially useful technique for measuring the internal stresses of freestanding thin films. By applying a small concentrated transverse load at the center of a pre-stretched film, and measuring the corresponding out-of-plane displacement at appropriate locations, the average internal stress can be readily determined. The load-deflection relationship has been derived for both circular and rectangular shapes. The method involves no additional micromachining in sample preparation and has low sensitivity to the variations in boundary constraints. Its feasibility has been further substantiated with finite element simulations from a variety of perspectives, as well as experimental correlations from the stress measurements of a photomask pellicle film.

Type
Research Article
Copyright
Copyright © Materials Research Society 2002

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References

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