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Thermal Stress Induced Void Formation in Narrow Passivated Cu Lines
Published online by Cambridge University Press: 22 February 2011
Abstract
0.75–3 μm wide copper lines encased in a thin adhesion layer of Al or Cr were passivated at 300°C and annealed at 400°C. The passivation was then removed and the lines examined in a scanning electron microscope. The development of thermal stress induced voiding was found to depend primarily on aging conditions and adhesion.
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- Copyright © Materials Research Society 1992
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