Skip to main content Accessibility help
×
Home

Thermal Chemical Vapor Deposition of Silicon Carbide Films as Protective Coatings for Microfluidic Structures

Published online by Cambridge University Press:  11 February 2011

Spyros Gallis
Affiliation:
School of NanoSciences and NanoEngineering, The University at Albany-SUNY, Albany, NY 12203
Ulrike Futschik
Affiliation:
School of NanoSciences and NanoEngineering, The University at Albany-SUNY, Albany, NY 12203
James Castracane
Affiliation:
School of NanoSciences and NanoEngineering, The University at Albany-SUNY, Albany, NY 12203
Alain E. Kaloyeros
Affiliation:
School of NanoSciences and NanoEngineering, The University at Albany-SUNY, Albany, NY 12203
Harry Efstathiadis
Affiliation:
School of NanoSciences and NanoEngineering, The University at Albany-SUNY, Albany, NY 12203
Walter Sherwood
Affiliation:
Starfire Systems Inc, Watervliet, NY 12189
Susan Hayes
Affiliation:
Starfire Systems Inc, Watervliet, NY 12189
Costas G. Fountzoulas
Affiliation:
Army Research Laboratory, Weapons Material Directorate, Aberdeen Proving Ground, MD, 21005.
Get access

Abstract

Amorphous silicon carbide (SiC) films were deposited on silicon substrates by thermal chemical vapor deposition (TCVD) technique, at substrate temperatures ranging from 620 °C - 850 °C. A novel, single-source halide free precursor, SP-4000, belonging to the family of polysilenemethylenes (PSM) (nominal structure [-SiH2-CH2-]n, n = 2–8 including branched and cyclic isomers) was used as source. Argon was used, as both the precursor carrier gas and the dilution gas. Other reactants, such as hydrogen or hydrocarbons, were not used. The deposition yielded films with Si/C ratio of 1±0.2. The highest achieved growth rate was 83 nm/min.

The modulus of elasticity and the nanohardness of the SiC films were measured with the aid of a nanoindenter at various depths, which did not exceed 25% of the film thickness. The average nanohardness at indentation depths of approximately 10% of the film thickness was measured up to 13 ± 4 GPa. The results of the nanoindentation will be discussed in conjunction with the microstructural analysis of the films.

In addition, the development of a viable TCVD SiC process presents significant opportunities in the nano/micro systems field. In particular, the ability to custom tailor the surfaces of microfluidic structures allows for the development of valves, pumps and channels for use in corrosive or high temperature environments. Initial results from the deposition of SiC films on prototype microfluidic components will be presented.

Type
Research Article
Copyright
Copyright © Materials Research Society 2003

Access options

Get access to the full version of this content by using one of the access options below.

References

1. Mehregany, M. and Zorman, C. A., Thin Solid Films, 355–356, 518, (1999).CrossRefGoogle Scholar
2. Ned, A., Kurtz, A., and Okojie, R., www.nasatech.com. Google Scholar
3. Pharr, G. and Oliver, W., Mat. Res. Soc. Bulletin, July 1992.Google Scholar
4. Futschik, U., Efstathiadis, H., Castracane, J. and Kaloyeros, A., Mat. Res. Soc. Symp. Proc., 495 (2001).Google Scholar
6. Woirgard, J., Cabioc'h, T., Riviere, J. and Dargenton, J., Surface and Coatings Technology, 100, 128 (1998).CrossRefGoogle Scholar
7. Scharf, T., Deng, H. and Barnard, J., J. Vac. Sci. Technol. A, 15, 963 (1997).CrossRefGoogle Scholar
8. Efstathiadis, H., Yin, Z., and Smith, F., Phys. Rev. B 46, 13119, (1997).CrossRefGoogle Scholar

Full text views

Full text views reflects PDF downloads, PDFs sent to Google Drive, Dropbox and Kindle and HTML full text views.

Total number of HTML views: 0
Total number of PDF views: 7 *
View data table for this chart

* Views captured on Cambridge Core between September 2016 - 25th January 2021. This data will be updated every 24 hours.

Hostname: page-component-76cb886bbf-tmbpq Total loading time: 0.216 Render date: 2021-01-25T02:22:42.993Z Query parameters: { "hasAccess": "0", "openAccess": "0", "isLogged": "0", "lang": "en" } Feature Flags: { "shouldUseShareProductTool": true, "shouldUseHypothesis": true, "isUnsiloEnabled": true, "metricsAbstractViews": false, "figures": false, "newCiteModal": false }

Send article to Kindle

To send this article to your Kindle, first ensure no-reply@cambridge.org is added to your Approved Personal Document E-mail List under your Personal Document Settings on the Manage Your Content and Devices page of your Amazon account. Then enter the ‘name’ part of your Kindle email address below. Find out more about sending to your Kindle. Find out more about sending to your Kindle.

Note you can select to send to either the @free.kindle.com or @kindle.com variations. ‘@free.kindle.com’ emails are free but can only be sent to your device when it is connected to wi-fi. ‘@kindle.com’ emails can be delivered even when you are not connected to wi-fi, but note that service fees apply.

Find out more about the Kindle Personal Document Service.

Thermal Chemical Vapor Deposition of Silicon Carbide Films as Protective Coatings for Microfluidic Structures
Available formats
×

Send article to Dropbox

To send this article to your Dropbox account, please select one or more formats and confirm that you agree to abide by our usage policies. If this is the first time you use this feature, you will be asked to authorise Cambridge Core to connect with your <service> account. Find out more about sending content to Dropbox.

Thermal Chemical Vapor Deposition of Silicon Carbide Films as Protective Coatings for Microfluidic Structures
Available formats
×

Send article to Google Drive

To send this article to your Google Drive account, please select one or more formats and confirm that you agree to abide by our usage policies. If this is the first time you use this feature, you will be asked to authorise Cambridge Core to connect with your <service> account. Find out more about sending content to Google Drive.

Thermal Chemical Vapor Deposition of Silicon Carbide Films as Protective Coatings for Microfluidic Structures
Available formats
×
×

Reply to: Submit a response


Your details


Conflicting interests

Do you have any conflicting interests? *