Hostname: page-component-848d4c4894-hfldf Total loading time: 0 Render date: 2024-04-30T21:00:23.931Z Has data issue: false hasContentIssue false
  • English
  • Français

The Role Of Surface Modification On Adhesion At The Metal/Polymer Interface

Published online by Cambridge University Press:  15 February 2011

M. J. Berry ,
I. Turlik ,
P. L. Smith  and
G. M. Adema
M. J. Berry
Affiliation:
MCNC, Center for Microelectronics PO Box 12889, 3021 Cornwallis Rd, RTP, NC 27709–2889
I. Turlik
Affiliation:
MCNC, Center for Microelectronics PO Box 12889, 3021 Cornwallis Rd, RTP, NC 27709–2889
P. L. Smith
Affiliation:
MCNC, Center for Microelectronics PO Box 12889, 3021 Cornwallis Rd, RTP, NC 27709–2889
G. M. Adema
Affiliation:
MCNC, Center for Microelectronics PO Box 12889, 3021 Cornwallis Rd, RTP, NC 27709–2889
Get access

Abstract

This paper presents studies of surface modifications of benzocyclobutene (BCB) using reactive ion etching (RIE), ion implantation, and combinations of those in conjunction with liftoff processing steps. It was found that O2/N2 RIE treatments of the BCB surface improve the adhesion of subsequently evaporated chromium and copper. Implant treatments with C+, O+, Si+, As+, and Sb+, were also investigated. The implant treated samples exhibited improved adhesion prior to subsequent heat treatments in the Cr/BCB structures and some improvement subsequent to heat treating in the Cu/BCB structures. Combinations of the surface modification treatments were seen to have the greatest benefit, even after heat treatments.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 227: Symposium J – Materials Science of High Temperature Polymers for Microelectronics , 1991 , 351
Copyright
Copyright © Materials Research Society 1991

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

[1] Egitto, F. D., Emmi, F., Horwath, R.S., JVST B 3 (3) May/Jun (1985).Google Scholar
[2] Paik, K. W., Saia, R.J., Chera, J.J., MRS Conf. Nov. 1990.Google Scholar
[3] Baglin, J.E.E., Nuc. Instr. Methods Phys. Res. B39 (1989).Google Scholar
[4] Williams, J.S., Rep. Prog. Phys. 49 (1986).CrossRefGoogle Scholar
[5] Adema, G.M., Turlik, I., Hwang, L.T., Rinne, G.A., Berry, M.J., IEEE Trans. (CHMT) 13,4,(1990).Google Scholar
[6] LeGoues, F.K., Silverman, B.D., Ho, P.S., JVST A 6 (4) Jul/Aug 1988.Google Scholar
[7] Jones, S K, Chapman, R.C., Dishon, G., Pavelchek, E.K., Proc. Eighth Int'l Conf. on Photopolymers, Oct. 1988 (SPE).Google Scholar
[8] Flutie, R.E., Materials Research Society, vol.62, 1986.Google Scholar
[9] Fong, S.O., Keister, F.Z., and Peters, J. W., 22nd. Int'l SAMPE Conference, Nov. 1990.Google Scholar