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The Relationship of Structure to Properties in Electrodeposited Films

Published online by Cambridge University Press:  22 February 2011

Keith Sheppard  and
Rolf Weil
Keith Sheppard
Affiliation:
Department of Materials and Metallurgical Engineering Stevens Institute of Technology, Hoboken, NJ 07030
Rolf Weil
Affiliation:
Department of Materials and Metallurgical Engineering Stevens Institute of Technology, Hoboken, NJ 07030
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Abstract

The recent development of a more systematic, scientific basis for knowledge in electrodeposition technology is discussed, focussing on the influence of microstructure on deposit properties. Internal stresses, tensile strength, ductility, preferred orientation and the ability to electrodeposit amorphous materials are considered. In particular the unique influence on these properties of small quantities of chemical additives is discussed. The application of current modulation techniques during electrodeposition is described as an alternative means of controlling structure and properties.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 47: Symposium C – Thin Films: The Relationship of Structure to Properties , 1985 , 127
Copyright
Copyright © Materials Research Society 1985

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References

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