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Principal Pilot Line Manufacturing Challenges and Solutions in Direct Fabrication of a-Si:H TFT Arrays on Flexible Substrates
Published online by Cambridge University Press: 01 February 2011
Principal challenges to direct fabrication of high performance a-Si:H transistor arrays on flexible substrates include automated handling through bonding-debonding processes, substrate-compatible low temperature fabrication processes, management of dimensional instability of plastic substrates, and planarization and management of CTE mismatch for stainless steel foils. In collaboration with our industrial and academic partners, we have developed viable solutions to address these challenges, as described in this paper.
- Research Article
- MRS Online Proceedings Library (OPL) , Volume 1030: Symposium G – Large-Area Processing and Patterning for Active Optical and Electronic Devices , 2007 , 1030-G07-05
- Copyright © Materials Research Society 2008