Published online by Cambridge University Press: 17 March 2011
The high porosity and uniform pore size provided by mesoporous oxide films offer interesting opportunities for MEMS devices that require low density and low thermal conductivity. This paper describes recent efforts at adapting mesoporous films for MEMS fabrication. Mesoporous SiO2 and Al2O3 films were prepared using block copolymers as the structure-directing agents, leading to films which were 70% porous and < 5 nm surface roughness. A number of etchants were investigated and good etch selectivity was observed with both dry and wet systems. Micromachining methods were used to fabricate cantilevers, micro bridges and membranes.
Full text views reflects PDF downloads, PDFs sent to Google Drive, Dropbox and Kindle and HTML full text views.