Hostname: page-component-77c89778f8-m42fx Total loading time: 0 Render date: 2024-07-21T04:29:45.620Z Has data issue: false hasContentIssue false

New Particle Metrology for CMP Slurries

Published online by Cambridge University Press:  01 February 2011

Kim Williams
Affiliation:
krwillia@mines.edu, ., ., ., ., FL, ., United States
Ilyong Park
Affiliation:
ilpark@mines.edu, Colorado School of Mines, Chemistry and Geochemistry, 1500 Illinois St., Golden, CO, 80401, United States
Edward E. Remsen
Affiliation:
edward_remsen@cabotcmp.com, Cabot Microelectronics Corporation, 870 North Commons Drive, Aurora, IL, 60504, United States
Mansour Moinpour
Affiliation:
mansour.moinpour@intel.com, Intel Corporation, 2200 Mission College Blvd., Santa Clara, CA, 95054, United States
Get access

Abstract

A new particle sizing and counting method based on the coupling of flow field-flow fractionation (FFF) with dual-sensor, single particle optical sensing (SPOS) detection is reported. The integration of FFF and SPOS systems was accomplished by means of a dilution interface that preserved the resolution of FFF-separated particles. Analysis of a model mixture of polystyrene latex standards of different diameters established that the FFF-SPOS system can resolve particles into discrete peaks for subsequent particle counting. Application of this method for the analysis of a colloidal silica standard demonstrated its use for materials commonly employed as CMP abrasives. Further development and refinement of the technique will enable compositional and structural analyses of heterogeneous large particle populations constituting commercial CMP slurries.

Type
Research Article
Copyright
Copyright © Materials Research Society 2007

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Steigerwald, J.M., Muraka, S.P. and Gutmann, R.J., Chemical Mechanical Planarization of Microelectronic Materials (John Wiley & Sons, New York, 1997).Google Scholar
2. Hanus, L.H., Battafarano, S.A. and Wank, A.R., MICRO 21, 71 (2003).Google Scholar
3. Nicholes, K., Litchy, M.R., Hood, E., Easter, W.G., Bhethanabotla, V.R., Cheema, L. and Grant, D.C., Proc. of the 8th CMP-MIC Conference, (2003), pp. 221223. Google Scholar
4. Remsen, E.E., Anjur, S., Boldridge, D., Kamiti, M., Li, S., Johns, T., Dowell, C. and Feeney, P., J. Electrochem. Soc. 153, G453–G461 (2006).Google Scholar
5. Bare, J.P. and Lemke, T.A., MICRO 15, 53 (1997).Google Scholar
6. Giddings, J.C., Science 260, 1456 (1993).Google Scholar
7. Jensen, K.D., Williams, S.K.R. and Giddings, J.C., J. Chromatogr. 746, 136 (1996).Google Scholar