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Microporous Crosslinked Elastomers

Published online by Cambridge University Press:  10 February 2011

J. L. Hedrick ,
S. Srinivasan ,
R. D. Miller ,
D. Y. Shih ,
Y.-H. Liao ,
J. G. Hilborn ,
C. J. G. Plummer  and
A. Della Martina
J. L. Hedrick
Affiliation:
IBM Research Division, Almaden Research Center, 650 Harry Road, San Jose, California 95120-6099
S. Srinivasan
Affiliation:
IBM Research Division, Almaden Research Center, 650 Harry Road, San Jose, California 95120-6099
R. D. Miller
Affiliation:
IBM Research Division, Almaden Research Center, 650 Harry Road, San Jose, California 95120-6099
D. Y. Shih
Affiliation:
I.B.M. Research, T. J. Watson Research Center, Yorktown Heights, New York 10598
Y.-H. Liao
Affiliation:
I.B.M. Research, T. J. Watson Research Center, Yorktown Heights, New York 10598
J. G. Hilborn
Affiliation:
Swiss Federal Institute of Technology, CH-1015 Lausanne, Switzerland
C. J. G. Plummer
Affiliation:
Swiss Federal Institute of Technology, CH-1015 Lausanne, Switzerland
A. Della Martina
Affiliation:
Swiss Federal Institute of Technology, CH-1015 Lausanne, Switzerland
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Abstract

Elastomeric connectors have been developed for a wide variety of interconnection and test applications which include module-to-board, board-to-board interconnections, high density module, board and LCD testings, as well as chip/wafer testing and burn-in to produce known-good-die. The density, compliance, thickness, pattern and size of these structures can be tailored to meet the requirements of each application. The fabrication processes involve wire bonding and polymer encapsulation. To achieve high compliance with low contact force, alternative means of generating highly compliant elastomers has been developed. This approach involves the incorporation of voids, where the reduction in the compressive force is simply achieved by replacing a portion of the polymer with air. Two approaches of generating porous elastomers are described along with the details of the porosity and mechanical properties.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 431: Symposium P – Microporous and Macroporous Materials , 1996 , 511
Copyright
Copyright © Materials Research Society 1996

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References

1. Gillet, J., Shrinking Design Space for Area Array Connectors: Proceeding of the National Electronic Packaging and Production Conference, 1992, pp. 1347–1361.Google Scholar
2. Beaman, B., Shih, D.-Y., and. Walker, G., A New Direction for ElastomericConnectors; Proceedings of the 43rd Electronic Components and Technology Conference, 1993, pp. 436–440.Google Scholar
3. Beaman, B., Doany, F., Fogel, K., Hedrick, J., Lauro, P., Norcott, M., Shih, D.-Y., and. Walker, G., Three Dimensional High Performance Interconnection Package, U.S. Patent 5,371,654, Dec. 1994.Google Scholar
4. Holm, R., in Electric Contacts Theory and Application; 4th Ed. (Springer-Verlag, 1981), pp. 367–379.Google Scholar
5. Riffle, J. S., Yilgor, I., Trans, C., , C., Wiles, G. L., and McGrath, J. E., Epoxy Resin-II Bauer, S., Ed., ACS Symposium Series 221; (American Chemical Society: Washington, D.C., 1983), Chapter 2.Google Scholar
6. Tran, C., Ph.D. Thesis, Virginia Polytechnic Institute and State University, 1985.Google Scholar
7. Yilgor, I., Riffle, J. S., Wilkes, G. L., and McGrath, J. E., Polym. Bull. 8 535 (1982).Google Scholar
8. Even, W. R. and Gregory, D. P., Material Research Society Bull. 19 (4), 29 (1994).Google Scholar