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Metal-Metal Interactions of Importance to Electronic Packaging

Published online by Cambridge University Press:  25 February 2011

Chin-An Chang
Chin-An Chang*
Affiliation:
IBM T. J. Watson Research Center, Yorktown Heights, N. Y. 10598
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Abstract

Metal-metal interactions have been of vital importance to various technologies, including packaging of electronic materials. Extensive interdiffusion and outdiffusion can lead to undesired alloy formation, and oxide formation on the surface which can hinder subsequent bonding processes. Furthermore, the interactions can be profoundly affected by the ambient gases used, either in the joining process or during subsequent storage and operation. One therefore needs a specially designed metallurgy, a diffusion barrier layer, or a proper ambient to deal with such concerns. The effects of ambient and diffusion barriers on the metal-metal interactions are described. Examples are illustrated where extensive interactions across the diffusion barrier are observed, and their impact on the packaging applications discussed.

Type
Articles
Information
MRS Online Proceedings Library (OPL) , Volume 72: Symposium G – Electronic Packaging Materials Science II , 1986 , 267
Copyright
Copyright © Materials Research Society 1986

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