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Mechanical and Electrical properties of Hydrogen or Helium Diluted a-Si:H Prepared at Low Temperatures

Published online by Cambridge University Press:  10 February 2011

Wan-Shick Hong
Affiliation:
Physics Division, Lawrence Berkeley National Laboratory, Berkeley CA 94720
Fan Zhong
Affiliation:
Physics Division, Lawrence Berkeley National Laboratory, Berkeley CA 94720
Victor Perez-Mendez
Affiliation:
Physics Division, Lawrence Berkeley National Laboratory, Berkeley CA 94720
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Abstract

Hydrogen or helium dilution of silane has been used to improve charge transport characteristics or deposition rate for thick amorphous silicon layers. In both cases, mechanical instability, such as peeling-off, due to high strain energy stored in the a-Si:H film is one of the major concerns. Growing the a-Si:H film at temperatures below 150°C brought the residual stress in the film to a level low enough to prevent delamination. The defect density increased at the same time, but it could be recovered by annealing at 160°C for 100 hours without affecting the stress state. In the hydrogen-diluted material, the deposition condition for optimum mobility and defect density values corresponded to the onset of the microcrystalline formation, and this relationship was confirmed by Transmission Electron Microscopy (TEM). Existence of a small amount of an ordered phase in the helium-diluted material, which was hardly observed by the TEM, was revealed by IR absorption spectra and supported by the change in ratio of photo-todark conductivity compared to that of undiluted material.

Type
Research Article
Copyright
Copyright © Materials Research Society 1996

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References

[1] Perez-Mendez, V., Cho, G., Drewery, J., Jing, T., Kaplan, S.N., Qureshi, S., Wildermuth, D., Goodman, C., Fujieda, I. and Street, R.A., Nucl. Phys., B 32 287 (1993)Google Scholar
[2] Equer, B. and Karar, A., Nucl. Instr. and Meth., A271 574 (1988)Google Scholar
[3] Hong, W.S., Drewery, J.S., Jing, T., Lee, H.-K., Kaplan, S.N., Mireshghi, A. and Perez-Mendez, V., Nucl. Instr. Meth., A356 239 (1995)Google Scholar
[4] Hong, W.S., Mireshghi, A., Drewery, J.S., Jing, T., Kaplan, S.N., Kitsuno, Y., Lee, H. and Perez-Mendez, V., IEEE Trans. Nucl. Sci., August (1995)Google Scholar
[5] Cho, G., Drewery, J.S., Hong, W.S., Jing, T., Lee, H., Kaplan, S.N., Mireshghi, A., Perez-Mendez, V. and Wildermuth, D., MRS Symp. Proc., 297 969 (1993)Google Scholar
[6] Kuo, Y., MRS Symp. Proc., 377 701 (1995)Google Scholar
[7] Tamahashi, K., Wakagi, M., Ishikawa, F., Kaneko, T., Tamura, K., Satoh, A. and Hanazono, M., Mat. Res. Soc. Symp. Proc., 192 621 (1990)Google Scholar
[8] Kakinuma, H., Nishikawa, S., Watanabe, T. and Nihei, K., J. Appl. Phys., 59 3110 (1986)Google Scholar
[9] Pochet, T., Illie, A., Foulon, F. and Equer, B., IEEE Trans. Nucl. Sci., 41 1014 (1994)Google Scholar
[10] Mireshghi, A., Lee, H.K., Hong, W.S., Drewery, J.S., Jing, T., Kaplan, S.N. and Perez-Mendez, V., Jap. J. Appl. Phys., 34 Part 1 3012 (1995)Google Scholar
[11] Hong, W.S., Petrova-Koch, V., Drewery, J., Jing, T., Lee, H. and Perez-Mendez, V., MRS Symp. Proc., 377 773 (1995)Google Scholar
[12] Chabloz, P., Keppner, H., Baertschi, V., Shah, A., Chatellard, D., Egger, J.-P., Menoreaz, M., Jeannet, E., Germond, J.-F., Vuilleumier, R., Mat. Res. Soc. Symp. Proc., 258 1057 (1992)Google Scholar
[13] Kitsuno, Y., Cho, G., Drewery, J., Hong, W.S. and Perez-mendez, V., Jap. J. Appl. Phys., 33 Part 1 3A 1261 (1994)Google Scholar
[14] Spear, W.E. and Heintze, M., Phil. Mag. B 54 343 (1986)Google Scholar
[15] Brenner, A. and Senderoff, S., J. Res. Nat'l. Bureau of Stanards, 42 105 (1949)Google Scholar
[16] Qureshi, S., Perez-Mendez, V., Cho, G., Fujieda, I., and Street, R.A., IEEE Trans. Nucl. Sci., NS–36 194 (1989)Google Scholar
[17] Spear, W.E., J. Non-Cryst. Sol., 1 197 (1968)Google Scholar
[18] Stevens, K.S. and Johnson, N.M., J. Appl. Phys., 71 2628 (1992)Google Scholar
[19] Ziegler, Y., Curtins, H., Baumann, J. and Shah, A., Mat. Res. Soc. Symp. Proc., 149 81 (1989)Google Scholar
[20] Fortmann, C.M., MRS Symp. Proc., 377 355 (1995)Google Scholar
[21] Hollingsworth, R.E. and Bhat, P.K., MRS Symp. Proc., 283 659 (1993)Google Scholar
[22] Koynov, S., Schwarz, R., Fischer, T., Brebner, S. and M~inder, H., Jap. J. Appl. Phys., 33 Part 1, 4534 (1994)Google Scholar