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MRS Online Proceedings Library (OPL) MRS Online Proceedings Library (OPL)

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High Frequency, High Density Interconnect Using AC Coupling

Published online by Cambridge University Press:  01 February 2011

Paul Franzon ,
Angus Kingon ,
Stephen Mick ,
John Wilson ,
Lei Luo ,
Karthik Chandrasakhar ,
Jian Xu ,
Salvatore Bonafede ,
Alan Huffman ,
Chad Statler  and
Richard LaBennett
Paul Franzon
Affiliation:
Department of Electrical and Computer Engineering
Angus Kingon
Affiliation:
Department of Electrical and Computer Engineering Department of Materials Science and Engineering
Stephen Mick
Affiliation:
Department of Electrical and Computer Engineering
John Wilson
Affiliation:
Department of Electrical and Computer Engineering
Lei Luo
Affiliation:
Department of Electrical and Computer Engineering
Karthik Chandrasakhar
Affiliation:
Department of Electrical and Computer Engineering
Jian Xu
Affiliation:
Department of Electrical and Computer Engineering
Salvatore Bonafede
Affiliation:
Department of Electrical and Computer Engineering
Alan Huffman
Affiliation:
Department of Electrical and Computer Engineering
Chad Statler
Affiliation:
Department of Electrical and Computer Engineering
Richard LaBennett
Affiliation:
Department of Electrical and Computer Engineering
Corresponding
E-mail address:
paulf@ncsu.edu
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Abstract

AC Coupled Interconnection (ACCI), in conjunction with buried solder bump technology, provides a method to achieve signal I/O pitches of less than 75 μm and signaling rates greater than 5 Gbps per I/O on integrated circuits, while preserving excellent signal integrity. This paper presents a summary of approaches, status, and discusses material issues important to performance.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 783: Symposium B – Materials, Intergration, and Packaging Issues for High-Frequency Devices , 2003 , B6.1
Copyright
Copyright © Materials Research Society 2004

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References

[1] Kühn, S. A., “Vertical Signal Transmission in Three-Dimensional Integrated Circuits by Capacitive Coupling”, 1995 IEEE International Symposium on Circuits and Systems. ISCAS '95, vol 1, 1995, pp 37–40.CrossRefGoogle Scholar
[2] Salzman, D., Knight, T., “Capacitively Coupled MultiChip Modules,”, Proc. 1994 IEEE Multichip Module Conference, pp. 487–494.Google Scholar
[3] Kanda, K., Dwi Antono, D., Ishida, K., Kawaguchi, H., Kuroda, T., Sakurai, T., “1.27 Gbp/s/pin 3mW/pin Wireless Suporconnect Interface Scheme, ISSCC 2003, 10.7. Google Scholar
[4] Mick, S. E., Wilson, J. M., and Franzon, P., “4 Gbps AC Coupled Interconnection,” (invited paper), IEEE Custom Integrated Circuits Conference, May 12–16, 2002, pp. 133–140.Google Scholar
[5] Mick, S., Luo, L., Wilson, J., Franzon, P., “Buried solder bump connections for high-density capacitive coupling,” IEEE Electrical Performance of Electronic Packaging, 2002, pp. 205–208.CrossRefGoogle Scholar
[6] Mick, S., Franzon, P., Huffman, A., “Packaging Technology for AC Coupled Interconnect,” in Proc. I4MAPS flip-chip Symposium, June 2000 Google Scholar

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