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Fabrication of Tungsten-Tellurite Glass Thin Films using Radio Frequency Magnetron Sputtering Method and Optical Property Characterization

Published online by Cambridge University Press:  15 March 2011

Ki-Young Yoo
Affiliation:
Center for Photonic Materials and Devices Department of Materials Science and Engineering, Chonnam National University300 Yongbong-Dong, Puk-Gu, Kwangju 500-757, South Korea
Sanghoon Shin
Affiliation:
Center for Photonic Materials and Devices Department of Materials Science and Engineering, Chonnam National University300 Yongbong-Dong, Puk-Gu, Kwangju 500-757, South Korea
Youngman Kim
Affiliation:
Center for Photonic Materials and Devices Department of Materials Science and Engineering, Chonnam National University300 Yongbong-Dong, Puk-Gu, Kwangju 500-757, South Korea
Jong-Ha Moon
Affiliation:
Center for Photonic Materials and Devices Department of Materials Science and Engineering, Chonnam National University300 Yongbong-Dong, Puk-Gu, Kwangju 500-757, South Korea
Jin Hyeok Kim
Affiliation:
Center for Photonic Materials and Devices Department of Materials Science and Engineering, Chonnam National University300 Yongbong-Dong, Puk-Gu, Kwangju 500-757, South Korea
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Abstract

Tungsten-tellurite glass thin films were fabricated by radio-frequency (rf) magnetron sputtering method at various processing parameters such as substrate temperatures, Ar/O2 processing gas flow ratio, processing pressure, and rf power from a 70TeO2-30WO3 target fabricated by solid–state sintering method. The effects of processing parameters on the growth rate, the surface morphologies, the crystallinity, and refractive indices of thin films were investigated using atomic force microscopy, X-ray diffractometer, scanning electron microscopy, and UV spectrometer. Amorphous glass thin films with a surface roughness of 4∼6 nm were obtained only at room temperature and crystalline phase were observed in all as-deposited thin films prepared at above the room temperature. The deposition rate strongly depends on the processing parameters. It increases as the rf power increases and the processing pressure decreases. Especially, it changes remarkably as varying the Ar/O2 gas flow ratio from 40sccm/0sccm to 0sccm/40sccm. When the films were formed in pure Ar atmosphere it shows a deposition rate of ∼0.2 μm /h, whereas ∼1.5 μm/h when the films was formed in pure O2 atmosphere.

Type
Research Article
Copyright
Copyright © Materials Research Society 2004

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