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Effect of Plasma Pre-Treatment on Dewetting Properties of CVD Cu on CVDW2N Barrier Layer

Published online by Cambridge University Press:  01 February 2011

Degang Cheng
Affiliation:
School of Nano Sciences and Nano Engineering, The University at Albany-SUNY Albany, NY12203, U.S.A.
Guillermo Nuesca
Affiliation:
School of Nano Sciences and Nano Engineering, The University at Albany-SUNY Albany, NY12203, U.S.A.
Eric Eisenbraun
Affiliation:
School of Nano Sciences and Nano Engineering, The University at Albany-SUNY Albany, NY12203, U.S.A.
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Abstract

The effect of different plasma pre-treatments of chemical vapor deposited (CVD) tungsten nitride (W2N) surfaces on the dewetting behavior of subsequently grown CVD Cu films was investigated by annealing the resulting film stacks in high purity argon. It was found that a hydrogen plasma pre-treatment significantly improved the resistance to Cu dewetting from the W2N surfaces while ammonia and nitrogen plasma pretreatment slightly accelerated the dewetting process. The proposed mechanisms and ramifications of these findings were discussed.

Type
Research Article
Copyright
Copyright © Materials Research Society 2003

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Effect of Plasma Pre-Treatment on Dewetting Properties of CVD Cu on CVDW2N Barrier Layer
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