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Effect of Microstructure on the Dissolution Kinetics of Copper Thin Films in Dilute Aqueous Solutions of Cupric Chloride

Published online by Cambridge University Press:  15 February 2011

L. Harper Walsh ,
N. B. Feilchenfeld  and
J. A. Schwarz
L. Harper Walsh
Affiliation:
Rome Laboratory, 525 Brooks Road, Griffiss Air Force Base, New York 13441-4505
N. B. Feilchenfeld
Affiliation:
IBM Microelectronics, Endicott, New York
J. A. Schwarz
Affiliation:
Department of Chemical Engineering and Materials Science, Syracuse University, Syracuse, New York 13244
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Abstract

Microstructural differences in copper deposited by four techniques commonly used in the microelectronics industry were previously reported. [1] The reaction rates were predicted using either grain size or grain orientation as the dominant microstructure characteristic. A practical method to monitor copper speciation was developed.[2] This technique was used to measure the reaction rates for the different copper films under two different etching conditions. The results are explained using grain size, grain orientation and near surface region composition.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 323: Symposium J – Electronic Packaging Materials Science VII , 1993 , 79
Copyright
Copyright © Materials Research Society 1994

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