Damage introduction in III-V nitrides during dry etching can be simulated by exposingthe samples to pure Ar plasmas for study of the physical (ion-bombardment) effects.Changes in conductivity of InN, In0.5Ga 0.5N and In0.5Al0.5N layers exposed to Ar plasmasunder both Electron Cyclotron Resonance and reactive ion etching conditions have beenmeasured as a function of rfpower, pressure and exposure time. The combination of highmicrowave and high rf powers produces large increases (10-_104 times) in sheet resistanceof the nitrides, but conditions more typical of real etching processes (rf power < 150W) donot change the bulk electrical properties. The nitrides are more resistant to damageintroduction than other III-V semiconductors. The removal of damage-related trapsoccurs with an activation energy of ∼2.7eV. High ion currents during ECR etching canproduce substantial conductivity changes, whereas the lower currents under RIEconditions do not affect the nitrides. It is difficult to avoid preferential loss of N in thenear-surface of these materials, which leads to leakage currents in rectifying metal contactsdeposited on these surfaces.