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Determination of the Mechanical Properties of Polysilicon Thin Films Using Bulge Testing

Published online by Cambridge University Press:  10 February 2011

S. Jayaraman
Affiliation:
Department of Materials Science and Engineering
R. L. Edwards
Affiliation:
Applied Physics Laboratory, The Johns Hopkins University, Baltimore, MD.
K. J. Hemker
Affiliation:
Department of Materials Science and Engineering
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Abstract

Using standard deposition and micromachining techniques, silicon substrates with square and rectangular windows covered with membranes of polycrystalline silicon (polysilicon) have been fabricated. Pressure-displacement curves obtained during the bulge testing of membranes with the above geometries have been used to determine the elastic constants E and v of the polysilicon. The results obtained (E = 162± 4 GPa and v = 0.19±0.03) are in good agreement with literature values for bulk polycrystalline silicon.

Type
Research Article
Copyright
Copyright © Materials Research Society 1998

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References

REFERENCES

1.Hammond, M.L., MRS Symp. Proc., 182, 3, (1990).Google Scholar
2.Beams, J.W., Structure and Properties of Thin Films (eds Nergebauer, C.A., Newkirk, J.B. and Vermilyea, D.A.), John Wiley and sons Inc., 183, (1959).Google Scholar
3.Levy, S., Proc. Symp. Appl. Math., 1, 197, (1947).Google Scholar
4.Timoshenko, S.P. and Woinowsky – Krieger, S., Theory of Plates and Shells, McGraw-Hill Inc., (1987).Google Scholar
5.Tabata, O., Kawahata, K., Sugiyama, S. and Igarashi, I., Sensors and Actuators A, 20, 135, (1989).Google Scholar
6.Vlassak, J.J., Ph.D. thesis, Stanford University, (1994).Google Scholar
7.Lin, P.H., Ph.D. thesis, Massachussets Institute of Technology, (1990).Google Scholar
8.Sharpe, W.N., Yuan, B., Vaidyanathan, R. and Edwards, R.L., Proc. 10th Int. Workshop on MEMS, 529, (1997).Google Scholar
9.Sharpe, W.N., Yuan, B., Vaidyanathan, R. and Edwards, R.L., SPIE, 2880, 78, (1996).Google Scholar
10.Jayaraman, S., Hemker, K.J. and Edwards, R.L., to be submitted to Journal of Materials Research.Google Scholar
11.Tsuchiya, T., Tabata, O., Sakata, J. and Taga, Y., Proc. 10th Int. Workshop on MEMS, 529, (1997).Google Scholar
12.Koshinken, J., Steinwall, E., Soave, R. and Johnson, H.H., J. Micromech. and Microengg., 3, 13, (1993).Google Scholar
13.Maier-Schneider, D. et al., J. Micromech. and Microengg., 5, 121, (1995).Google Scholar
14.Michalicek, M.A., Sene, D.E. and Bright, V.M., Proc. Int. Conf. on Integrated Micro/Nanotechnology for space application, NASA and Aerospace Corp. 214, (1995).Google Scholar
15.Biebl, M., Brandl, G. and Howe, R.T., Proc. 8th Int. Conf. on Solid State Actuators and Eurosensors, IX, 80, (1995).Google Scholar
16.Biebl, M. et al., Sensors and Actuators A, 46, 593, [1995].Google Scholar