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Deformation Behavior of Nanocrystalline Co-Cu Alloys

Published online by Cambridge University Press:  31 January 2011

Motohiro Yuasa
Affiliation:
yuasamotohiro@t03.mbox.media.kyoto-u.ac.jp, Kyoto University, Kyoto, Japan
Hiromi Nakano
Affiliation:
hiromi@crfc.tut.ac.jp, Toyohashi University of Technology, Toyohashi, Japan
Kota Kajikawa
Affiliation:
gabacho@t04.mbox.media.kyoto-u.ac.jp, Kyoto University, Kyoto, Japan
Takumi Nakazawa
Affiliation:
Nakazawa.Takumi@17chikyu.mbox.media.kyoto-u.ac.jp, Kyoto University, Kyoto, Japan
Mamoru Mabuchi
Affiliation:
mabuchi@energy.kyoto-u.ac.jp, Kyoto University, Kyoto, Japan
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Abstract

Three kinds of nanocrystalline Co-Cu alloys: a nanocrystalline Co-Cu alloy with nanoscale lamellar structure, a supersaturated solid solution Co-Cu alloy and a nanocrystalline two-phase Co-Cu alloy were processed by electrodeposition, and their mechanical properties were investigated at room temperature. These nanocrystalline Co-Cu alloys showed the high hardness and the low activation volume. The mechanical properties of the nanocrystalline Co-Cu alloys strongly depended on the grain boundary characteristics. Molecular dynamics simulations were performed in the two-phase nanocrystalline Co-Cu alloy to investigate the dislocation emission at the Co/Cu interface. The MD simulations showed that the stacking faults, which are generated by the intense geometrical strain at the Co/Cu interface, play an important role in the dislocation emission.

Type
Research Article
Copyright
Copyright © Materials Research Society 2010

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