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Decohesion of Thin Films From Ceramic Substrates

Published online by Cambridge University Press:  26 February 2011

R. M. Cannon ,
R. M. Fisher  and
A. G. Evans
R. M. Cannon
Affiliation:
Center For Advanced Materials, Lawrence Berkeley Laboratory University of California, Berkeley, CA 94720
R. M. Fisher
Affiliation:
Center For Advanced Materials, Lawrence Berkeley Laboratory University of California, Berkeley, CA 94720
A. G. Evans
Affiliation:
Center For Advanced Materials, Lawrence Berkeley Laboratory University of California, Berkeley, CA 94720
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Abstract

Decohesion of thin films from ceramic or semiconductor substrates is strongly influenced by internal stresses in films and stress concentrations from edges or flaws as well as by interfacial fracture energy. Residual stresses can cause spontaneous delamination, splitting and curling of films under tension or delamination, buckling and spal ling of films under residual compression, even with good interfacial bonding. Delamination behavior is considered using simple fracture mechanics models, supplemented with preliminary measurements of interfacial fracture energies. Formation conditions largely control internal stresses in films; whereas fracture energies are dictated by interfacial chemistry and mechanical factors such as plasticity.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 54: Symposium E – Thin Films–Interfaces and Phenomena , 1985 , 799
Copyright
Copyright © Materials Research Society 1986

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References

REFERENCES

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