Hostname: page-component-77c89778f8-gvh9x Total loading time: 0 Render date: 2024-07-20T13:30:24.040Z Has data issue: false hasContentIssue false

A Comparison of the Mixing Rates for Fe-Ti and Ni-Ti Bilayers

Published online by Cambridge University Press:  25 February 2011

P. Børgesen
Affiliation:
Dept.of Materials Science and Engineering, Cornell UniversityIthaca, NY 14853. USA
D. A. Lilienfeld
Affiliation:
National Nanofabrication Facility, Cornell UniversityIthaca, NY 14853. USA
R. E. Wistrom
Affiliation:
Dept.of Materials Science and Engineering, Cornell UniversityIthaca, NY 14853. USA
H. H. Johnson
Affiliation:
Dept.of Materials Science and Engineering, Cornell UniversityIthaca, NY 14853. USA
Get access

Abstract

Previous comparisons of the room temperature mixing of Ni-Ti and Fe-Ti multilayers have shown significant differences in the mixing rates in spite of closely similar heats of mixing as well as ballistic properties. This result suggests contributions from mechanisms other than ballistic and thermal spike effects, or a break-down of present thermal spike models for these materials. In order to identify the mixing mechanisms involved, quantitative measurements were made at various temperatures between 80K and 350K using bilayer samples. Surprisingly, the mixing rates were found to disagree significantly with those estimated for multilayer samples.

Type
Research Article
Copyright
Copyright © Materials Research Society 1989

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

[1] Hirvonen, J.-P., Elve, M. A., Mayer, J. W., and Johnson, H. H., Mater. Sci. & Eng. 90, 13 (1987).10.1016/0025-5416(87)90190-XGoogle Scholar
[2] Saito, K. and Iwaki, M., Nucl. Instrum. Meth. B7–8, 626 (1985).10.1016/0168-583X(85)90445-8Google Scholar
[3] Rai, A. K., Bhattacharya, R. S., Pronko, P. P., and Tai-il-Mah, , Surf. & Interface Anal. 10, 142 (1987).10.1002/sia.740100214Google Scholar
[4] Brenier, R., Thevenard, P., Capra, T., Perez, A., Treilleux, M., Romana, L., Dupuy, J., and Brenel, M., Nucl. Instrum. Meth. B19/20, 691 (1987).10.1016/S0168-583X(87)80138-6Google Scholar
[5] Gras-Marti, A. and Sigmund, P., Nucl. Instrum. Meth. 180, 211 (1981).10.1016/0029-554X(81)90032-XGoogle Scholar
[6] Sigmund, P. and Gras-Marti, A., Nucl. Instrum. Meth. 182/183, 25 (1981).10.1016/0029-554X(81)90668-6Google Scholar
[7] Cheng, Y.-T., Rossum, M. Van, Nicolet, M.-A., and Johnson, W. L., Appl. Phys. Lett. 45, 185 (1984).10.1063/1.95163Google Scholar
[8] Johnson, W. L., Cheng, Y. T., Rossum, M. Van, and Nicolet, M.-A., Nucl. Instrum. Meth. B7/8, 657 (1985).10.1016/0168-583X(85)90450-1Google Scholar
[9] Børgesen, P., Wistrom, R. E., Johnson, H. H., and Lilienfeld, D. A., submitted to J. Mater. Res.Google Scholar
[10] Børgesen, P., Lilienfeld, D. A., and Johnson, H. H., submitted to J. Appl. Phys.Google Scholar
[11] Averback, R. S., Peak, D., and Thompson, L. J., Appl. Phys. A39, 59 (1986).10.1007/BF01177164Google Scholar
[12] Bhattacharya, R. S. and Rai, A. K., J. Appl. Phys. 58, 248 (1985); see also Erratum, J. Appl. Phys. 58, (1985) 2798.10.1063/1.335719Google Scholar
[13] Wistrom, R. E., Børgesen, P., Lilienfeld, D. A., and Johnson, H. H., these proceedings.Google Scholar
[14] Chu, W.-K., Mayer, J. V., and Nicolet, M.-A., “Backscattering Spectrometry”, Acad. Press, NY, 1978.Google Scholar
[15] L'Ecuyer, J., Brassard, C., Cardinal, C., and Terreault, B., Nucl. Instrum. Meth. 149, 271 (1978).10.1016/0029-554X(78)90872-8Google Scholar
[16] Doyle, B. L. and Peercy, P. S., Appl. Phys. Lett. 34, 811 (1979).10.1063/1.90654Google Scholar
[17] Doolittle, L. R., Nucl. Instrum. Meth. B9, 344 (1985).10.1016/0168-583X(85)90762-1Google Scholar
[18] Almén, O. and Bruce, G., Nucl. Instrum. Meth. 11, 257 and 279 (1961).10.1016/0029-554X(61)90026-XGoogle Scholar
[19] Rai, A. K., Bhattacharya, R. S., and Rashid, M. H., Thin Solid Films 137, 305 (1986).10.1016/0040-6090(86)90032-5Google Scholar