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Ceramics and Glass-Ceramics in Electronic Packaging
Published online by Cambridge University Press: 25 February 2011
Abstract
An overview of ceramic packaging as it evolved over the last two decades from dual-in-line packages to state-of-the-art multilayer multichip packages ispresented. IBM's 69 layer glass-ceramic/copper multilayer multichip substrate with dielectric constant of 5.0, thermal expansion exactly matching silicon and exceptional dimensional control is summarized.
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- Copyright © Materials Research Society 1991
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