Hostname: page-component-78c5997874-dh8gc Total loading time: 0 Render date: 2024-11-04T19:19:26.912Z Has data issue: false hasContentIssue false

Ceramic Fiber - Fluoropolymer Composites for Electronic Packaging Materials

Published online by Cambridge University Press:  21 February 2011

John D. Bolt*
Affiliation:
E. I. du Pont de Nemours & Co., Experimental Station, Wilmington, DE 19880-0262
Get access

Abstract

Aluminum nitride (AIN), alumina and aramid fibers have been incorporated into epoxy and fluoropolymer matrices. The fluoropolymer composites have dielectric constants less than 3.4 and losses below 0.3%, measured out-of-plane. In-plane and out-of-plane thermal conductivities of the AIN-fluoropolymer composites averaged 5.2 and 1.3 W/mK, respectively, at fiber volume fractions of 0.26 to 0.29. In-plane thermal conductivities of woven fabric composites were accurately predicted by mixing rules; for non-woven and short fiber composites, thermal conductivities were less than predicted. These composites had higher out-of-plane thermal conductivities due to out-of-plane components of the fiber orientations.

Type
Research Article
Copyright
Copyright © Materials Research Society 1989

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Button, D. P., Yost, B. A., French, R. H., Hsu, W. Y., Bolt, J. D., Subramanian, M. A., Zhang, H.-M., Giedd, R. E., Whittaker, A. J., Onn, D. G., in Advances in Ceramics Vol. 26 Ceramic Substrates and Packages, edited by O'Bryan, H. M., Niwa, K., Young, W., Yan, M. F., (American Ceramics Society, Columbus, OH 1989) in press.Google Scholar
2. Jensen, R. H., Bydal, B. A., Button, D. P., in Advances in Ceramics Vol.26 Ceramic Substrates and Packages, edited by O'Bryan, H. M., Niwa, K., Young, W., Yan, M. F., (American Ceramics Society, Columbus, OH 1989) in press.Google Scholar
3. Bolt, J. D., Tebbe, F. N., in Electronic Packaging Materials Science III. edited by Jaccodine, R., Jackson, K. A., Sundahl, R. C. (Mater. Res. Soc. Proc. 108, Pittsburgh, PA 1988), pp. 337–44.Google Scholar
4. Angstrom, M. A. J., Philosophy Magazine, 25, 130 (1863).Google Scholar
5. Giedd, R. E., Onn, D. G., in Thermal Conductivity 20 (Plenum Press, New York, 1989) edited by Hasselman, D. P.H., p. 339.Google Scholar