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Carbon Nanotube Deposition using Helicon Plasma CVD at Low Temperature

Published online by Cambridge University Press:  01 February 2011

Masakazu Muroyama
Affiliation:
Sony Corporation, 4-16-1 Okata Atsugi-shi, Kanagawa, 243-0021, JAPAN
Takao Yagi
Affiliation:
Sony Corporation, 4-16-1 Okata Atsugi-shi, Kanagawa, 243-0021, JAPAN
Kouji Inoue
Affiliation:
Sony Corporation, 4-16-1 Okata Atsugi-shi, Kanagawa, 243-0021, JAPAN
Ichiro Saito
Affiliation:
Sony Corporation, 4-16-1 Okata Atsugi-shi, Kanagawa, 243-0021, JAPAN
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Abstract

We developed a novel growth method of aligned carbon nanotubes. Aligned carbon nanotubes are grown on a metal catalyst on a glass substrate using biased Helicon plasma chemical vapor deposition (HPECVD) of CH4/H2 gases from 400 C to 500 C. The Helicon plasma source is one of the high-density plasma sources and is promising for low temperature carbon deposition. A Ni film was used as a catalyst to reduce the activation energy of the nanotubes' growth. The carbon nanotubes were deposited on the nickel catalysis layer selectively.

Type
Research Article
Copyright
Copyright © Materials Research Society 2002

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References

1. Robertson, J., Proceeding of the Materials Research Society Fall, (1999).Google Scholar
2. Journet, C., Maser, WK., Bernier, P., Loiseau, A., Lamy de la Chapelle, M., Lefarant, S., Deniard, P., Lee, R., Fischer, J.E., Nature 75, 756–8 (1997).Google Scholar
3. Zhu, W., Bower, C., Zhou, O., Kochanski, G., Jin, S, Appl. Phys. Lett. 75, 873–5 (1999).Google Scholar
4. Fan, S., Michael, G., Chapline, G., Franklin, N.R., Tombler, T.W, Cassell, A.M., Dai, H., Science 283, 512–4 (1999).Google Scholar
5. Tsai, S.H, Chao, C.W., Lee, C.L., Shih, H.C., Appl. Phys. Lett. 74, 3462–4 (1999).Google Scholar
6. Chen, Y., Shaw, D.T., Guo, L, Appl. Phys. Lett. 76, 2469–71 (2000).Google Scholar
7. Yudasaka, M., Kikuchi, R., Ohki, Y., Yoshimura, S., Carbon 35, 195201 (1997).Google Scholar
8. Li, D.C., Dai, L., Huang, S., Mau, A.W.N., Wang, Z.L., Chem. Phys. Lett. 316, 349–55 (2000).Google Scholar