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The Adhesion of Pad Particles on Wafer Surfaces during Cu CMP

Published online by Cambridge University Press:  01 February 2011

Jae-Hoon Song
Affiliation:
Div of Materials and Chemical Engineering, Hanyang University, Ansan, 426-791, Korea +82-31400-5226, +82-31-417-3701, jgpark@hanyang.ac.kr
Ja-Hyung Han
Affiliation:
Div of Materials and Chemical Engineering, Hanyang University, Ansan, 426-791, Korea +82-31400-5226, +82-31-417-3701, jgpark@hanyang.ac.kr
Yi-Koan Hong
Affiliation:
Div of Materials and Chemical Engineering, Hanyang University, Ansan, 426-791, Korea +82-31400-5226, +82-31-417-3701, jgpark@hanyang.ac.kr
Young-Jae Kang
Affiliation:
Div of Materials and Chemical Engineering, Hanyang University, Ansan, 426-791, Korea +82-31400-5226, +82-31-417-3701, jgpark@hanyang.ac.kr
Jin-Goo Park
Affiliation:
Div of Materials and Chemical Engineering, Hanyang University, Ansan, 426-791, Korea +82-31400-5226, +82-31-417-3701, jgpark@hanyang.ac.kr
Ju-Ho Maeng
Affiliation:
Div of Materials and Chemical Engineering, Hanyang University, Ansan, 426-791, Korea +82-31400-5226, +82-31-417-3701, jgpark@hanyang.ac.kr
Young-Man Won
Affiliation:
Div of Materials and Chemical Engineering, Hanyang University, Ansan, 426-791, Korea +82-31400-5226, +82-31-417-3701, jgpark@hanyang.ac.kr
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Abstract

The adhesion force of pad and alumina were experimentally and theoretically investigated in slurry solutions of different pHs. The isoelectric point (IEP) of pad particles was measured to be around pH 3. The wafer surfaces showed negative zeta potentials in the investigated pH ranges with exception of FSG and Ta. Cu and Ta showed higher interaction forces than dielectric materials. The lowest adhesion force was measured between pad particle and wafer surfaces in a slurry solution of pH 11. The magnitude of adhesion force of pad particles was lower than alumina particles.

Type
Research Article
Copyright
Copyright © Materials Research Society 2005

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