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Adhesion of Copper to Polytetrafluoroethylene

Published online by Cambridge University Press:  22 February 2011

Yong-Kil Kim ,
Chin-An Chang ,
A.G. Schrott ,
J. Andreshak  and
M. Cali
Yong-Kil Kim
Affiliation:
IBM Research Division, T. J. Watson Research Center, Yorktown Heights, NY 10598
Chin-An Chang
Affiliation:
IBM Research Division, T. J. Watson Research Center, Yorktown Heights, NY 10598
A.G. Schrott
Affiliation:
IBM Research Division, T. J. Watson Research Center, Yorktown Heights, NY 10598
J. Andreshak
Affiliation:
IBM Research Division, T. J. Watson Research Center, Yorktown Heights, NY 10598
M. Cali
Affiliation:
IBM Research Division, T. J. Watson Research Center, Yorktown Heights, NY 10598
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Abstract

An enhancement of the adhesion between copper and polytetrafluoroethylene (PTFE) has been studied. Thin-films of copper were electron-beam deposited on the surface of the polymer substrates. Peel test measurements showed that, without any treatment of the substrates, the adhesion was poor with a peel strength of 1-2 g/mm. A pronounced enhancement of the adhesion has been obtained when the fluorocarbon substrates were treated by either an ultraviolet (UV) irradiation, an ion-beam presputtering prior to the metal deposition, or heat treatments after the deposition. Among the treatments employed, the ion-beam sputtering was the most effective in improving the adhesion. The roles of the treatments and possible reasons for the enhanced adhesion are discussed in conjunction with the studies of interface morphology and chemistry using Scanning Electron Microscopy, Rutherford Backscattering Spectroscopy, and X-ray Photoelectron Spectroscopy.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 153: Symposium J – Interfaces Between Polymers, Metals, and Ceramics , 1989 , 279
Copyright
Copyright © Materials Research Society 1989

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References

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