Hostname: page-component-7479d7b7d-q6k6v Total loading time: 0 Render date: 2024-07-11T14:07:06.606Z Has data issue: false hasContentIssue false
  • English
  • Français

AC Electrodeposition of Uniform High Aspect-Ratio Metal Nanowires in Porous Aluminum Oxide Templates

Published online by Cambridge University Press:  15 February 2011

Nathan J. Gerein ,
Shazma S. Mithani  and
Joel A. Haber
Nathan J. Gerein
Affiliation:
Department of Chemistry, University of Alberta Edmonton, AB, T6G 2G2, Canada
Shazma S. Mithani
Affiliation:
Department of Chemistry, University of Alberta Edmonton, AB, T6G 2G2, Canada
Joel A. Haber
Affiliation:
Department of Chemistry, University of Alberta Edmonton, AB, T6G 2G2, Canada
Get access

Abstract

The use of alternating current (ac) electrodeposition permits deposition through the resistive Al2O3 barrier layer, enabling the use of the as-grown porous aluminum oxide (PAO) template. This results in a process that is cost effective, simple, and scalable. However, achieving uniform filling using this technique is challenging. We have carried out a systematic study of the effect of multiple variables on the ac electrodeposition of copper nanowires using a fractional factorial design of experiment (FFDOE). This experiment led to the identification of template damage that occurs when continuous wave ac deposition conditions are employed, as well as to effective pulsed wave ac electrodeposition conditions. Subsequent examination of the effect of wave shape has identified the impact of this variable on electrodeposition, producing a further optimized set of ac electrodeposition conditions. The utility of these electrodeposition conditions has also been extended to the deposition of iron nanowires with similar results.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 879: Symposium Z – Chemistry of Nanomaterial Synthesis and Processing , 2005 , Z11.9
Copyright
Copyright © Materials Research Society 2005

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1. Shingubara, S., J. Nanopart. Res. 5 (1-2), 17 (2003).Google Scholar
2. Thompson, G.E. and Wood, G.C., in Treatise on Materials Science and Technology, edited by Scully, J.C. (Academic Press, New York, 1983), Vol. 23, pp. 205.Google Scholar
3. AlMawlawi, D., Coombs, N., and Moskovits, M., J. Appl. Phys. 70 (8), 4421 (1991).Google Scholar
4. Yin, A.J., Li, J., Jian, W. et al., Appl. Phys. Lett. 79 (7), 1039 (2001).Google Scholar
5. Sun, M., Zangari, G., and Metzger, R.M., IEEE Trans. Magn. 36 (5), 3005 (2000).Google Scholar
6. Sun, M., Zangari, G., Shamsuzzoha, M. et al., Appl. Phys. Lett. 78 (19), 2964 (2001).Google Scholar
7. Sauer, G., Brehm, G., Schneider, S. et al., J. Appl. Phys. 91 (5), 3243 (2002).Google Scholar
8. Box, G.E.P., Hunter, W.G., and Hunter, J.S., Statistics For Experimenters. (John Wiley & Sons, Inc., 1978).Google Scholar
9. Gerein, N.J. and Haber, J.A., manuscript submitted to J. Phys Chem. B.Google Scholar
10. Li, F., Zhang, L., and Metzger, R.M., Chem. Mater. 10, 2470 (1998).Google Scholar
11. Masuda, H., Hasegwa, F., and Ono, S., J. Electrochem. Soc. 144 (5), L127 (1997).Google Scholar
12. Masuda, H. and Fukuda, K., Science 268 (5216), 1466 (1995).Google Scholar