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3-D Integration Technology for High Performance Detector Arrays

  • Dorota Temple (a1), Christopher A. Bower (a2), Dean Malta (a3), James E. Robinson (a4), Phillip R. Coffman (a5), Mark R. Skokan (a6) and Terry B. Welch (a7)...

Abstract

This paper describes a technology for three-dimensional (3-D) integration of multiple layers of silicon integrated circuits. The technology promises to dramatically enhance on-chip signal processing capabilities of a variety of detector devices hybridized with Si electronics. The focus of the paper is on high performance infrared focal plane arrays based on HgCdTe, which offer the ultimate in infrared sensitivity and find application in high performance military systems. Performance data from test FPA devices with integrated multilayer Si stacks are discussed in this paper.

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1. Horn, S., Norton, P., Carson, K., Eden, R. and Clement, R., “Vertically Integrated Sensor Arrays,Proc. of SPIE, Vol. 5406, p. 332340, 2005.10.1117/12.548880
2. Robinson, J., Wood, L., Krueger, E., Coffman, P., Temple, D., Malta, D., and Bower, C.A., “Vertically Integrated Sensor Arrays for Enhanced Performance HgCdTe FPAs,” Proc. of GOMACTech-06, p. 297300, 2006.
3. Robinson, J., Wood, L., Murphy, T., Coffman, P. Temple, D., Malta, D., Bower, C.A., and Stoner, B.R., “VISA Technology for High Operating Temperature HgCdTe FPAs,” Proc. of GOMACTech-05, 2005.
4. Bower, C.A., Malta, D., Temple, D., Robinson, J.E., Coffman, P.R., Skokan, M.R. and Welch, T.B., “High Density Vertical Interconnects for 3-D Integration of Silicon Integrated Circuits,” Proc. 56th Electronic Components and Technology Conference, San Diego, May 2006, p.399403.
5. Kinch, M.A., “HDVIP™ FPA Technology at DRS,” Proceedings of SPIE, Vol. 4369, p. 566579, 2001 10.1117/12.445316
6. Dreiske, Peter D.Development of Two-Color Focal-Plane Arrays Based on HDVIP®”, Proc. of SPIE, Vol. 5783, 2005, p. 325.10.1117/12.609127

Keywords

3-D Integration Technology for High Performance Detector Arrays

  • Dorota Temple (a1), Christopher A. Bower (a2), Dean Malta (a3), James E. Robinson (a4), Phillip R. Coffman (a5), Mark R. Skokan (a6) and Terry B. Welch (a7)...

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