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Plasma Surface Engineering of Metals

Published online by Cambridge University Press:  29 November 2013

Kyon-Tschong Rie ,
Erich Menthe ,
Allan Matthews ,
Keith Legg  and
Jack Chin
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Extract

The marketplace is continually demanding better functionality in the surface and near-surface properties of metal components and tools. In the last 20 years, plasma and ion-assisted techniques have enabled new methods to substantially improve wear, corrosion, and fatigue resistance. In most cases, plasmas are used to enhance well-established processes such as thermochemical diffusion treatment and physical and chemical vapor deposition (PVD and CVD), but their operation in a plasma atmosphere has led to major improvements in their reliability and efficacy, as well as extending the range of materials and components that can be treated.

Type
Plasma Processing of Advanced Materials
Information
MRS Bulletin , Volume 21 , Issue 8 , August 1996 , pp. 46 - 51
Copyright
Copyright © Materials Research Society 1996

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References

1.Michel, H., Czerwiec, T., Gantois, M., Ablitzer, D., and Ricard, A., Surf. Coat. Technol. 72 (1995) p. 103.CrossRefGoogle Scholar
2.Bougdira, J., Henrion, G., Fabry, M., Remy, M., and Cussenot, J.R., Mater. Sci. Eng. A139 (1991) p. 15.CrossRefGoogle Scholar
3.Jack, K.H., in Heat Treatment '73 (The Metals Society, London, 1975) p. 39.Google Scholar
4.Ichii, K., Fujimura, K., and Takase, T., Technol. Rep. Kansai Univ. 27 (1986) p. 135.Google Scholar
5.Menthe, E., Rie, K-T., Schultze, J.W., and Simson, S., Surf. Coat. Technol. 74–75 (1995) p. 412.CrossRefGoogle Scholar
6.Rie, K-T., Stucky, T., Silva, R.A., Leitão, E., Bordji, K., Jouzeau, J-Y., and Mainard, D., Surf. Coat. Technol. 74–75 1995 p. 973.CrossRefGoogle Scholar
7.Chen, H-Y., Stock, H-R., and Mayr, P., Surf. Coat. Technol. 64 (1994) p. 139.CrossRefGoogle Scholar
8.Rie, K-T. and Schnatbaum, F., Metall. 44 (1990) p. 732.Google Scholar
9.Arai, T., Fujita, H., and Tachikawa, H., in Proc. Int. Conf. on Ion Nitriding, Cleveland, September 1986 (ASM International, Metals Park, OH, 1987) p. 37.Google Scholar
10.Booth, M., Farrel, T., and Johnson, R.H., Heat Treat. Metals 10 (1983) p. 45.Google Scholar
11.Edenhofer, B., Hart.-Tech. Mitt. 45 (1990) p. 154.Google Scholar
12.Melber, A., Schnatbaum, F., Preißer, F., Rie, K-T., and Laudin, G., Hart.-Tech. Mitt. 48 (1993) p. 182.Google Scholar
13.Wierzchon, T., Pokrasen, S., and Karpinski, T., Hart.-Tech. Mitt. 38 (1983) p. 57.Google Scholar
14.Casadesus, P. and Gantois, M., Hart.-Tech. Mitt. 33 (1978) p. 202.Google Scholar
15.Dearnley, P.A., Farrell, T., and Bell, T., in Proc. 5th Int. Conf. on Ion and Plasma Assisted Techniques, Munich, May 1985 (CEP Consultants, Edinburgh, 1985) p. 359.Google Scholar
16.Bonifield, T.D., in Deposition Technologies for Films and Coatings, edited by Bunshah, R.F. (Noyes Data Corp., Park Ridge, NJ, 1982) p. 365.Google Scholar
17.Bachmann, P.K., Gartner, G., and Lydtin, H., MRS Bulletin XIII (12) (1988) p. 52.CrossRefGoogle Scholar
18.Reif, R. and Kern, W., in Thin Film Processes II, edited by Vossen, J.L. and Kern, W. (Academic Press, San Diego, 1991) p. 525.CrossRefGoogle Scholar
19.Chin, J., in Advanced Surface Engineering, edited by Sproul, W.D. and Legg, K.O. (National Institute of Standards and Technology, Gaithersburg, MD, 1994) p. 65.Google Scholar
20.Albir, L., in Proc. 6th Europ. Conf. on Chemical Vapour Deposition, Jerusalem, March-April 1987 (Iscar, Nahariya, Israel, 1987) p. 58.Google Scholar
21.Rie, K-T., Eisenberg, S., Konig, U., van den Berg, H., and Tabersky, R., in Proc. 6th Europ. Conf. on Chemical Vapour Deposition, Jerusalem, March-April 1987 (Iscar, Nahariya, Israel, 1987) p. 311.Google Scholar
22.Rie, K-T., Pfohl, C., Lee, S-H., and Kang, C-S., to be presented at the Fifth International Conference on Plasm a Surface Engineering (Garmisch-Partenkirchen, September 1996).Google Scholar
23.Kikuchi, N., Oosawa, Y., and Nishiyama, A., in Proc. 9th Int. Conf. on Chemical Vapour Deposition, Pennington NJ, May 1984 (Electrochemical Society, Pennington, NJ, 1984) p. 728.Google Scholar
24.Rie, K-T., Wöhle, J., and Gebauer, A., J. Phys. IV 1 (C2) (1991) p. 397.Google Scholar
25.Rie, K-T., Gebauer, A., and Wöhle, J., Surf. Coat. Technol. 74–75 (1995) p. 362.CrossRefGoogle Scholar
26.Rie, K-T., Wöhle, J., and Gebauer, A., to be presented at the Fifth International Conference on Plasm a Surface Engineering (Garmisch-Partenkirchen, September 1996).Google Scholar
27.Moisan, M., Barbeau, C., Claude, R., Ferreira, C.M., Margot, J., Paraszczak, J., Sa, A.B., Sauve, G., and Wertheimer, M.R., J. Vac. Sci. Technol. B 9 (1991) p. 8.CrossRefGoogle Scholar
28.Thornton, J.A., in Deposition Technologies for Films and Coatings, edited by Bunshah, R.F. (Noyes Data Corp., Park Ridge, NJ, 1982) p. 19.Google Scholar
29.Wertheimer, M.R. and Moisan, M., J. Vac. Sci. Technol. A 3 (1985) p. 2643.CrossRefGoogle Scholar
30.Rie, K-T., Gebauer, A., and Wohle, J., Plasma Chem. Plasma Process. 13 (1993) p. 93.CrossRefGoogle Scholar
31.Hu, Y.Z., Li, M., Simko, J., Andrews, J., and Irene, E.A., in Proc. 11th Int. Conf. on Chemical Vapour Deposition, edited by Spear, K.E. and Cullen, G.W. (Electrochemical Society, Pennington, NJ, 1990) p. 166.Google Scholar
32.Tsu, D.V. and Lucovsky, G., J. Vac. Sci. Technol. A 4 (1986) p. 482.CrossRefGoogle Scholar
33.Claassen, W.A.P., Valkenburg, W.G.J.N., Habraken, F.H.P.M., and Tamminga, Y., J. Electrochem. Soc. 130 (1983) p. 2419.CrossRefGoogle Scholar
34.Landheer, D., Skinner, N.G., Jackman, T.E., Thompson, D.A., Simmons, J.G., Stevanovic, D.V., and Khatamian, D., J. Vac. Sci. Technol. A 9 (1991) p. 2594.CrossRefGoogle Scholar
35.Tsu, D.V., Parsons, G.N., and Lucovsky, G., J. Vac. Sci. Technol. A 6 (1988) p. 1649.CrossRefGoogle Scholar
36.Nguyen, S.V. and Albaugh, K., J. Electrochem. Soc. 136 (1989) p. 2835.CrossRefGoogle Scholar
37.Hobler, W.M. and Foster, J., J. Vac. Sci. Technol. A 8 (1990) p. 3720.Google Scholar
38.ASM Handbook, vol. 5 (ASM International, Materials Park, OH, 1994).Google Scholar
39.Mattox, D.M., in Deposition Technologies or Films and Coatings, edited by Bunshah, R.F. (Noyes Data Corp., Park Ridge, NJ, 1982).Google Scholar
40.Martin, P.J., IEEE Trans. Plasma Sci. 18 (1990) p. 855.CrossRefGoogle Scholar
41.Fancey, K.S. and Matthews, A., in Advanced Surface Coatings, edited by Rickerby, D.S. and Matthews, A. (Blackie, London, 1991) p. 127.CrossRefGoogle Scholar
42.Muller, K-H., Phys. Rev. B 35 (1987) p. 7906.CrossRefGoogle Scholar
43.Muller, K-H., J. Vac. Sci. Technol. A 5 (1987) p. 2161.CrossRefGoogle Scholar
44.Jehn, H.A., in Advanced Techniques for Surface Engineering, edited by Gissler, W. and Jehn, H.A. (Kluwer Academic Publishers, Dordrecht, 1992).Google Scholar
45.Matthews, A., J. Vac. Sci. Technol. A 3 (1985) p. 2354.CrossRefGoogle Scholar
46.Dearnaley, G., in Advanced Surface Coatings, edited by Ricker, D.S. by and Matthews, A. (Blackie, London, 1991) p. 41.CrossRefGoogle Scholar
47.Klug, K.W. and Zoller, A., Mater. Sci. Eng. A 140 (1991) p. 523.Google Scholar
48.Boxman, R.L. and Goldsmith, S., Surf. Coat. Technol. 33 (1987) p. 153.CrossRefGoogle Scholar
49.Rossnagel, S.M., in Advanced Surface Coatings, edited by Ricker, D.S. by and Matthews, A. (Blackie, London, 1991) p. 14.CrossRefGoogle Scholar
50.Petrov, I., Adibi, F., Greene, J.E., Hultman, L., and Sundgren, J-E., Appl. Phys. Lett. 63 (1993) p. 36.CrossRefGoogle Scholar
51.Hakansson, G., Hultman, L., Sundgren, J-E., Greene, J.E., and Munz, W-D., Surf. Coat. Technol. 48 (1991) p. 51.CrossRefGoogle Scholar
52.Adibi, F., Petrov, I., Greene, J.E., Hultman, L., and Sundgren, J-E., J. Appl. Phys. 73 (1993) p. 8580.CrossRefGoogle Scholar
53.Sanders, D.M., Boercker, D.B., and Falabella, S., IEEE Trans. Plasma Sci. 18 (1990) p. 883.CrossRefGoogle Scholar
54.Fancey, K.S. and Matthews, A., JEEE Trans. Plasma Sci. 18 (1990) p. 869.CrossRefGoogle Scholar
55.Window, B. and Savvides, N., J. Vac. Sci. Technol. A 4 (1986) p. 453.CrossRefGoogle Scholar
56.Savvides, N. and Window, B., J. Vac. Sci. Technol. A 4 (1986) p. 504.CrossRefGoogle Scholar
57.Sproul, W.D., Rudnik, P.J., Graham, M.E., and Rohde, S.L., Surf. Coat. Technol. 43/44 (1990) p. 270.CrossRefGoogle Scholar
58.Rohde, S.L., Petrov, I., Sproul, W.D., Barnett, S.A., Rudnik, P.J., and Graham, M.E., Thin Solid Films 193/194 (1990) p. 117.CrossRefGoogle Scholar
59.Tominaga, K., Vacuum 41 (1990) p. 1154.CrossRefGoogle Scholar