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Multiscale Modeling of Thin-Film Deposition: Applications to Si Device Processing

  • F.H. Baumann, D.L. Chopp, T. Díaz de la Rubia, G.H. Gilmer, J.E. Greene, H. Huang, S. Kodambaka, P. O'Sullivan and I. Petrov...

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Metallization is the back end of the integrated-circuit (IC) fabrication process where the transistor interconnections are formed. Figure 1 shows the metallized part of a static random-access memory chip. Metal lines for electrical connections (Al and Cu) in Si devices are deposited as blanket films and then etched or polished away to define the conducting lines.

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