Skip to main content Accessibility help
×
Home

Development and Application of an Abrasive-Free Polishing Solution for Copper

  • Masanobu Hanazono, Jin Amanokura and Yasuo Kamigata

Abstract

An abrasive-free polishing (AFP) solution for chemical–mechanical planarization (CMP) of copper films on semiconductor wafers has been developed to overcome such disadvantages of conventional CMP as dishing, erosion, Cu and oxide loss, and microscratching. Electrochemical methods are an effective way of understanding the role of each chemical component in the AFP solution in order to optimize its performance. Analysis of the reaction layer of Cu elucidates the reasons for the excellent results that have been obtained. By applying the AFP solution for Cu CMP in combination with a slurry for CMP of the metal barrier layer, seven-level multilayer Cu interconnections can be successfully fabricated.

Copyright

References

Hide All
1.Edelstein, D., Heidenreich, J., and Goldblatt, R., in IEDM Tech. Dig. (Institute of Electrical and Electronics Engineers, Piscataway, NJ, 1997) p. 773.
2.Tyagi, S., Alavi, M., Bigwood, R., and Bramlet, T., in IEDM Tech. Dig. (Institute of Electrical and Electronics Engineers, Piscataway, NJ, 2000) p. 567.
3.Besser, P., Marathe, A., and Zhao, L., in IEDM Tech. Dig. (Institute of Electrical and Electronics Engineers, Piscataway, NJ, 2000) p. 119.
4.Osseo-Asare, K. and Mishara, K., J. Electron. Mater. 25 (10) (1996) p. 1599.
5.Kondo, S., Sakuma, N., Homma, Y., and Ohashi, N., in Proc. Int. Interconnect Technology Conf. (Institute of Electrical and Electronics Engineers, Piscataway, NJ, 2000) p. 253.
6.Yamaguchi, H., Ohashi, N., Imai, T., and Hinode, K., in Proc. Int. Interconnect Technology Conf. (Institute of Electrical and Electronics Engineers, Piscataway, NJ, 2000) p. 264.
7.Kamigata, Y., Kurata, Y., Masuda, K., Amanokura, J., Yoshida, M., and Hanazono, M., in Chemical–Mechanical Polishing 2001—Advances and Future Challenges, edited by Babu, S.V., Cadien, K.C., and Yano, H. (Mater. Res. Soc. Symp. Proc. 671, Warrendale, PA, 2001) p. M1.3.1.
8.Kondo, S., Homma, Y., Sakuma, N., Takeda, K., and Hinode, K., Polishing Method, Eur. Pat. Appl. EP0913442A2, May 6, 1999.

Keywords

Related content

Powered by UNSILO

Development and Application of an Abrasive-Free Polishing Solution for Copper

  • Masanobu Hanazono, Jin Amanokura and Yasuo Kamigata

Metrics

Full text views

Total number of HTML views: 0
Total number of PDF views: 0 *
Loading metrics...

Abstract views

Total abstract views: 0 *
Loading metrics...

* Views captured on Cambridge Core between <date>. This data will be updated every 24 hours.

Usage data cannot currently be displayed.