Crossref Citations
This article has been cited by the following publications. This list is generated based on data provided by
Crossref.
Hegde, Sharath
and
Babu, S. V.
2003.
Removal of Shallow and Deep Scratches and Pits from Polished Copper Films.
Electrochemical and Solid-State Letters,
Vol. 6,
Issue. 10,
p.
G126.
Feng, Xiandong
Her, Yie-Shein.
Linda., W.
Davis, Jackie
Oswald, Eric
Lu, Jin
Bryg, Vicky
Freeman, Sara
and
Gnizak, Dave
2003.
CeO2 Particles for Chemical Mechanical Planarization.
MRS Proceedings,
Vol. 767,
Issue. ,
Bahar Basim, G.
Brown, Scott C.
Vakarelski, Ivan U.
and
Moudgil, Brij M.
2003.
Strategies for Optimal Chemical Mechanical Polishing (CMP) Slurry Design.
Journal of Dispersion Science and Technology,
Vol. 24,
Issue. 3-4,
p.
499.
Lu, J.
Garland, J.E.
Petite, C.M.
Babu, S.V.
and
Roy, D.
2003.
Electrochemical Studies of Copper Chemical Mechanical Polishing Mechanism: Effects of Oxidizer Concentration.
MRS Proceedings,
Vol. 767,
Issue. ,
Ein-Eli, Y.
Abelev, E.
Rabkin, E.
and
Starosvetsky, D.
2003.
The Compatibility of Copper CMP Slurries with CMP Requirements.
Journal of The Electrochemical Society,
Vol. 150,
Issue. 9,
p.
C646.
Noh, K.
Saka, N.
and
Chun, J.-H.
2004.
Effect of Slurry Selectivity on Dielectric Erosion and Copper Dishing in Copper Chemical-Mechanical Polishing.
CIRP Annals,
Vol. 53,
Issue. 1,
p.
463.
Abiade, J. T.
Choi, W.
Khosla, V.
and
Singh, R. K.
2004.
Investigation and Control of Chemical and Surface Chemical Effects During Dielectric CMP.
MRS Proceedings,
Vol. 816,
Issue. ,
Choi, Wonseop
Lee, Seung-Mahn
and
Singh, Rajiv K.
2004.
pH and Down Load Effects on Silicon Dioxide Dielectric CMP.
Electrochemical and Solid-State Letters,
Vol. 7,
Issue. 7,
p.
G141.
Dalis, Adamos
and
Friedlander, Sheldon K.
2004.
A Molecular Dynamics Study of Short Nanoparticle Chains under Mechanical Strain: Linear and Kinked Configurations.
MRS Proceedings,
Vol. 821,
Issue. ,
Jiang, Yong
Adams, James B.
and
Sun, Donghai
2004.
Benzotriazole Adsorption on Cu2O(111) Surfaces: A First-Principles Study.
The Journal of Physical Chemistry B,
Vol. 108,
Issue. 34,
p.
12851.
Lu, J.
Garland, J. E.
Pettit, C. M.
Babu, S. V.
and
Roy, D.
2004.
Relative Roles of H[sub 2]O[sub 2] and Glycine in CMP of Copper Studied with Impedance Spectroscopy.
Journal of The Electrochemical Society,
Vol. 151,
Issue. 10,
p.
G717.
Sieger, H.
Winterer, M.
Mühlenweg, H.
Michael, G.
and
Hahn, H.
2004.
Controlling Surface Composition and Zeta Potential of Chemical Vapor Synthesized Alumina‐Silica Nanoparticles.
Chemical Vapor Deposition,
Vol. 10,
Issue. 2,
p.
71.
Choi, Wonseop
Lee, Seung-Mahn
Abiade, Jeremiah
and
Singh, Rajiv K.
2004.
Estimation of Fractional Surface Coverage of Particles for Oxide CMP.
Journal of The Electrochemical Society,
Vol. 151,
Issue. 5,
p.
G368.
Ein-Eli, Y.
Abelev, E.
and
Starosvetsky, D.
2004.
Electrochemical aspects of copper chemical mechanical planarization (CMP) in peroxide based slurries containing BTA and glycine.
Electrochimica Acta,
Vol. 49,
Issue. 9-10,
p.
1499.
Zantye, Parshuram B.
Kumar, Ashok
and
Sikder, A.K.
2004.
Chemical mechanical planarization for microelectronics applications.
Materials Science and Engineering: R: Reports,
Vol. 45,
Issue. 3-6,
p.
89.
Ein-Eli, Y.
Abelev, E.
and
Starosvetsky, D.
2004.
Electrochemical Behavior of Copper in Conductive Peroxide Solutions.
Journal of The Electrochemical Society,
Vol. 151,
Issue. 4,
p.
G236.
Borst, Christopher L.
Smith, Stanley M.
and
Eissa, Mona
2004.
Challenges and Rewards of Low-Abrasive Copper CMP: Evaluation and Integration for Single-Damascene Cu/Low-k Interconnects for the 90nm Node.
MRS Proceedings,
Vol. 816,
Issue. ,
Choi, Wonseop
Mahajan, Uday
Lee, Seung-Mahn
Abiade, Jeremiah
and
Singh, Rajiv K.
2004.
Effect of Slurry Ionic Salts at Dielectric Silica CMP.
Journal of The Electrochemical Society,
Vol. 151,
Issue. 3,
p.
G185.
Ein-Eli, Y.
Abelev, E.
Auinat, M.
and
Starosvetsky, D.
2005.
Observation of Extended Copper Passivity in Carbonate Solutions and Its Future Application in Copper CMP.
Electrochemical and Solid-State Letters,
Vol. 8,
Issue. 12,
p.
B69.
Visintin, Pamela M.
Carbonell, Ruben G.
Schauer, Cynthia K.
and
DeSimone, Joseph M.
2005.
Chemical Functionalization of Silica and Alumina Particles for Dispersion in Carbon Dioxide.
Langmuir,
Vol. 21,
Issue. 11,
p.
4816.