Hostname: page-component-77c89778f8-9q27g Total loading time: 0 Render date: 2024-07-16T17:36:10.216Z Has data issue: false hasContentIssue false

Exploiting New Opportunities in Materials Research by Remembering and Applying Old Lessons

Published online by Cambridge University Press:  31 January 2011

Get access

Abstract

Recalling some of the progress that has been made in understanding the mechanical properties of materials over the past 50 years or so reveals the importance of remembering and applying old lessons when addressing new opportunities in materials research. Often, the classical lessons of the past are especially useful as a guide for thinking about new problems. Such an approach to new problems is intimately connected to the creation of simple models that capture the essential features of the phenomena involved. Experience shows that, although such efforts might not pay off immediately, they come to be useful many years later when new problems are confronted. The merit of applying old lessons to new problems is described herein by using examples from the author's career in characterizing and understanding the mechanical properties of materials. It is hoped that these lessons are sufficiently general to be applied to other areas of materials research. Problems ranging from the high-temperature creep resistance of titanium aluminides, to the residual stresses in deposited thin films, to diffusive relaxation processes in thin films, to the size dependence of the strength of crystalline materials at the nanometer scale, all provide examples of how applying lessons of the past can help to understand new problems. An effort is also made to identify new, emerging problems in materials research where the application of the lessons of the past, together with new capabilities of the future, can come together to produce a fresh understanding of material behavior.

Type
Research Article
Copyright
Copyright © Materials Research Society 2009

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1Mott, N.F., Conference on Creep and Fracture of Metals (Philosophical Library, Inc., New York, 1957), p. 21.Google Scholar
2Sherby, O.D., Orr, R.L., Dorn, J.E., Trans. AIME 200, 113 (1954).Google Scholar
3Hirsch, P.B., Horne, R.W., Whelan, M.J., Philos. Mag. 1, 677 (1956).CrossRefGoogle Scholar
4Barrett, C.R., Nix, W.D., Acta Metall. 13, 1247 (1965).CrossRefGoogle Scholar
5Rosenthal, D., Trans. ASME 68, 849 (1946).Google Scholar
6Viswanathan, G.B., Vasudevan, V.K., Mills, M.J., Acta Mater. 47, 1399 (1999).CrossRefGoogle Scholar
7Abermann, R., Koch, R., Thin Solid Films 62, 195 (1979).CrossRefGoogle Scholar
8Floro, J.A., Chason, E., Cammarata, R.C., Srolovitz, D.J., MRS Bull. 27, 19 (2002).CrossRefGoogle Scholar
9Phillips, M.A., Ramaswamy, V., Nix, W.D., Clemens, B.M., J. Mater. Res. 15, 2540 (2000).CrossRefGoogle Scholar
10Doljack, F.A., Hoffman, R.W., Thin Solid Films 12, 71 (1972).CrossRefGoogle Scholar
11Nix, W.D., Clemens, B.M., J. Mater. Res. 14, 3467 (1999).CrossRefGoogle Scholar
12Griffith, A.A., Philos. Trans. A 221, 163 (1920).Google Scholar
13Seel, S.C., Thompson, C.V., Hearne, S.J., Floro, J.A., J. Appl. Phys. 88, 7079 (2000).CrossRefGoogle Scholar
14Kobrinsky, M.J., Thompson, C.V., Appl. Phys. Lett. 73, 2429 (1998).CrossRefGoogle Scholar
15Gao, H., Zhang, L., Nix, W.D., Thompson, C.V., Arzt, E., Acta Mater. 47, 2865 (1999).CrossRefGoogle Scholar
16Westergaard, H.M., J. Appl. Mech. 6, 49 (1939).CrossRefGoogle Scholar
17Coble, R.L., J. Appl. Phys. 34, 1679 (1963).CrossRefGoogle Scholar
18Balk, T.J., Dehm, G., Arzt, E., Acta Mater. 51, 4471 (2003).CrossRefGoogle Scholar
19Gilman, J.J., Micromechanics of Flow in Solids (McGraw-Hill, New York, 1969), p. 188.Google Scholar
20Reppich, B., Haasen, P., Ilschner, B., Acta Metall. 12, 1283 (1964).CrossRefGoogle Scholar
21Uchic, M.D., Dimiduk, D.M., Florando, J.N., Nix, W.D., Science 13, 5686 (2004).Google Scholar
22Greer, J.R., Oliver, W.C., Nix, W.D., Acta Mater. 53, 1821 (2005).CrossRefGoogle Scholar
23Volkert, C.A., Lilleodden, E.T., Philos. Mag. 86, 5567 (2006).CrossRefGoogle Scholar
24Johnston, W.G., Gilman, J.J., J. Appl. Phys. 30, 129 (1959).CrossRefGoogle Scholar
25Chen, Z.-W., Misra, R.K., Asif, A., Warren, O.L., Minor, A.M., Nat. Mater. 7, 115 (2008).Google Scholar
26Frank, F.C., van der Merwe, J.H., Proc. R. Soc. London, Ser. A 198, 205 (1949).Google Scholar
27Matthews, J.W., Blakeslee, A.E., J. Cryst. Growth 27, 118 (1974).Google Scholar
28Lauhon, L.J., Gudiksen, M.S., Wang, D., Lieber, C.M., Nature 420, 57 (2002).CrossRefGoogle Scholar
29Goldthorpe, I.A., Marshall, A.F., McIntyre, P.C., Nano Lett. 8, 4081 (2008).CrossRefGoogle Scholar
30Freund, L.B., Adv. Appl. Mech. 30, 1 (1994).Google Scholar
31Freund, L.B., Nix, W.D., Appl. Phys. Lett. 69, 173 (1996).CrossRefGoogle Scholar
32Liang, Y.Nix, W.D., Griffin, P.B., Plummer, J.D., J. Appl. Phys. 97, 043519–1 (2005).CrossRefGoogle Scholar