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3D Printed Bioelectronic Platform with Embedded Electronics

Published online by Cambridge University Press:  16 May 2018

Shweta Agarwala*
Affiliation:
Singapore Centre for 3D Printing (SC3DP), School of Mechanical and Aerospace Engineering, Nanyang Technological University (NTU), 50 Nanyang Avenue, Singapore 639798
Jia Min Lee
Affiliation:
Singapore Centre for 3D Printing (SC3DP), School of Mechanical and Aerospace Engineering, Nanyang Technological University (NTU), 50 Nanyang Avenue, Singapore 639798
Wai Yee Yeong
Affiliation:
Singapore Centre for 3D Printing (SC3DP), School of Mechanical and Aerospace Engineering, Nanyang Technological University (NTU), 50 Nanyang Avenue, Singapore 639798
Michael Layani
Affiliation:
Singapore Centre for 3D Printing (SC3DP), School of Mechanical and Aerospace Engineering, Nanyang Technological University (NTU), 50 Nanyang Avenue, Singapore 639798 Institute of Chemistry, Casali Center for Applied Chemistry, Hebrew University of Jerusalem, Israel 91904
Shlomo Magdassi
Affiliation:
Institute of Chemistry, Casali Center for Applied Chemistry, Hebrew University of Jerusalem, Israel 91904
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Abstract

Silver nanoparticle based microelectrodes embedded between layers of hydrogel material were successfully fabricated. 3D bioprinting is employed to print the entire bioelectronics platform comprising of conducting silver ink and Gelatin methacryloyl (GelMA) hydrogel. The additive manufacturing technique of bioprinting gives design freedom for the circuit, saves material and shortens the time to fabricate the bioelectronics platform. The silver platform shows excellent electrical conductivity, structural flexibility and stability in wet environment. It is tested for biocompatibility using C2C12 murine myoblasts cell line. The work demonstrates the potential of the fabricated platform for the realization of practical bioelectronic devices.

Type
Articles
Copyright
Copyright © Materials Research Society 2018 

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References

He, Q., Severac, F., Hajjoul, H., Viero, Y., and Bancaud, A., Langmuir 27, 65986605 (2011).CrossRefGoogle Scholar
Tran, T. B., Cho, S., and Min, J., Biosensors and Bioelectronics 50, 453459 (2013).CrossRefGoogle Scholar
Sridhar, V., Takahata, K., Sensors and Actuators A 155, 5865 (2009).CrossRefGoogle Scholar
Ahn, Y., Lee, H., Lee, D., and Lee, Y., ACS Appl. Mater. Interfaces 6, 1840118407 (2014).CrossRefGoogle Scholar
Chua, C. K., and Leong, K. F., “3D Printing and Additive Manufacturing: Principles and Applications”, 5th Ed. Rapid Prototyping, 2017Google Scholar
Rosen, D. W., Virtual and Physical Prototyping 11, 305317 (2016).CrossRefGoogle Scholar
Kruth, J. -P., Leu, M. C., and Nakagawa, T., CIRP Annals 47, 525540 (1998).CrossRefGoogle Scholar
Chua, C. K., Yeong, W. Y., and An, J., Micromachines 8, 229 (2017).CrossRefGoogle Scholar
Nakamura, M., Mir, T. A., Arai, K., Ito, S., Yoshida, T., Iwanaga, S., Kitano, H., Obara, C., Nikaido, T., International Journal of Bioprinting 1, 3948 (2015).Google Scholar
Magdassi, S., Grouchko, M., Berezin, O., Kamyshny, A., ACS Nano 4, 19431948 (2010).CrossRefGoogle Scholar
Nichol, J. W., Koshy, S. T., Bae, H., Hwang, C. M., Yamanlar, S., and Khademhosseini, A., Biomaterials, 31, 5536–44, (2010).CrossRefGoogle Scholar