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Surface Morphology of Mechanically Strained Silicate Glass Films on Alumina Substrates

Published online by Cambridge University Press:  02 July 2020

A.V. Zagrebelny  and
C.B. Carter
A.V. Zagrebelny
Affiliation:
Department of Chemical Engineering and Materials Science, University of Minnesota, 421 Washington Ave., SE, Minneapolis, MN55455-0132
C.B. Carter
Affiliation:
Department of Chemical Engineering and Materials Science, University of Minnesota, 421 Washington Ave., SE, Minneapolis, MN55455-0132
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Extract

It has been long recognized that the understanding of mechanical properties of thin films on substrates requires an understanding of the stresses in the film structures as well as a knowledge of mechanisms by which thin films deform. It has also been shown that these stresses may compromise the performance of integrated circuits, magnetic media, etc. The presence of residual and thermal stresses between the matrix and intergranular films in structural multiphase ceramics is the most common mechanism of failure that often causes deformation and fracture

In this paper, the effect of residual stress on mechanical properties of silicate-glass films on single-crystal α-Al2O3 substrates has been studied with AFM with the emphasis on the changes in surface morphology associated with the film strain and relaxation. The deformation of thin layers of glass on crystalline materials has also been examined using newly developed experimental methods for nanomechanical testing.

Type
Scanned Probe Microscopies: Technologies, Methodologies, and Applications
Information
Microscopy and Microanalysis , Volume 3 , Issue S2: Proceedings: Microscopy & Microanalysis '97, Microscopy Society of America 55th Annual Meeting, Microbeam Analysis Society 31st Annual Meeting, Histochemical Society 48th Annual Meeting, Cleveland, Ohio, August 10-14, 1997 , August 1997 , pp. 1281 - 1282
Copyright
Copyright © Microscopy Society of America 1997

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References

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5. Research is supported by the U. S. DoE under Grant No. DE-FG02-92ER45465. The AFM and Hysitron indenter are part of the University of Minnesota Characterization Facility supported in part by Center for Interfacial Engineering, an NSF Engineering Research Center.Google Scholar