Hostname: page-component-84b7d79bbc-rnpqb Total loading time: 0 Render date: 2024-07-27T19:27:29.449Z Has data issue: false hasContentIssue false
  • English
  • Français

Specimen Thickness Effects on EBSD Patterns in the Sem

Published online by Cambridge University Press:  02 July 2020

J. R. Michael
J. R. Michael*
Affiliation:
Materials Characterization Dept., Sandia National Laboratories, Albuquerque, NM87185-0886
Get access

Abstract

Electron backscatter diffraction (EBSD) in the SEM has become a widely used technique for both automated orientation mapping and the identification of unknown crystalline phases. Despite the rapidly growing use of this technique for the above applications, there has been relatively little fundamental research concerned with determining the thickness of the surface layer that generates the EBSD pattern. EBSD patterns are related through reciprocity to electron channeling patterns. Based on this assumption the thickness of the surface layer that an EBSD pattern is generated in is 2 or 3 extinction distances. Extinction distances at low SEM voltages (10-20 kV) are quite short. Thus, EBSD patterns are generated in very thin surface layers. This paper will discuss the results of a study of the information depth of EBSD in the SEM.

Previous research has attempted to determine the information depth of EBSD by obtaining patterns from samples that have had layers of other crystalline or microcrystalline material deposited on the surface.

Type
Diffraction Techniques in TEM and SEM
Information
Microscopy and Microanalysis , Volume 7 , Issue S2: Proceedings: Microscopy & Microanalysis 2001, Microscopy Society of America 59th Annual Meeting, Microbeam Analysis Society 35th Annual Meeting, Long Beach, California August 5-9, 2001 , August 2001 , pp. 380 - 381
Copyright
Copyright © Microscopy Society of America 2001

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1. Wells, O. C., Scanning.,21(1999)368.CrossRefGoogle Scholar

2. Reimer, L., Scanning Electron Microscopy, Springer, 1998,355.Google Scholar

3. Joy, D. C., Proc. of the 52nd MSA Meeting, 1994, 592.CrossRefGoogle Scholar

4. Troost, K., et al., Proc. of the 52nd MSA Meeting, 1994, 606.CrossRefGoogle Scholar

5. Isabell, T. C., et al., Ultramicroscopy,67(1997)59.CrossRefGoogle Scholar

6. Ren, S. X., et al., Microscopy and Microanalysis,4(1997)15.CrossRefGoogle Scholar

7. Prenitzer, B. I., PhD. Dissertation, University of Central Florida, 1999.Google Scholar

8. This work was supported by the United States Department of Energy under Contract DE-AC04-94AL85000. Sandia is a multiprogram laboratory operated by Sandia Corporation, a Lockheed Martin Company, for the United States Department of Energy.Google Scholar