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Sample preparation for aberration-corrected microscopy of high-quality TEM specimens of advanced integrated circuits

Published online by Cambridge University Press:  01 August 2018

C.S. Bonifacio ,
M. Campin ,
K. McIlwrath ,
M. Ray  and
P.E. Fischione
C.S. Bonifacio
Affiliation:
E.A. Fischione Instruments, Inc., Export, PA, USA
M. Campin
Affiliation:
E.A. Fischione Instruments, Inc., Export, PA, USA
K. McIlwrath
Affiliation:
JEOL USA, Peabody, MA, USA
M. Ray
Affiliation:
E.A. Fischione Instruments, Inc., Export, PA, USA
P.E. Fischione
Affiliation:
E.A. Fischione Instruments, Inc., Export, PA, USA

Abstract

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Type
Abstract
Information
Microscopy and Microanalysis , Volume 24 , Supplement S1: Proceedings of Microscopy & Microanalysis 2018 , August 2018 , pp. 150 - 151
Copyright
© Microscopy Society of America 2018 

References

[1] Lapedus, M, Semiconductor Engineering (2018 https://semiengineering.com/nodes-vs-node-lets/.Google Scholar
[2] Mistry, K. Intel Corporation Technology and Manufacturing Day (2017).Google Scholar
[3] Feng, H., et al. Proceedings of the 40th International Symposium for Testing and Failure Analysis, (2014), p. 478.Google Scholar