Hostname: page-component-848d4c4894-tn8tq Total loading time: 0 Render date: 2024-07-06T18:42:10.671Z Has data issue: false hasContentIssue false
  • English
  • Français

Sample preparation for aberration-corrected microscopy of high-quality TEM specimens of advanced integrated circuits

Published online by Cambridge University Press:  01 August 2018

C.S. Bonifacio ,
M. Campin ,
K. McIlwrath ,
M. Ray  and
P.E. Fischione
C.S. Bonifacio
Affiliation:
E.A. Fischione Instruments, Inc., Export, PA, USA
M. Campin
Affiliation:
E.A. Fischione Instruments, Inc., Export, PA, USA
K. McIlwrath
Affiliation:
JEOL USA, Peabody, MA, USA
M. Ray
Affiliation:
E.A. Fischione Instruments, Inc., Export, PA, USA
P.E. Fischione
Affiliation:
E.A. Fischione Instruments, Inc., Export, PA, USA

Abstract

An abstract is not available for this content so a preview has been provided. As you have access to this content, a full PDF is available via the ‘Save PDF’ action button.
Image of the first page of this content. For PDF version, please use the ‘Save PDF’ preceeding this image.'
Type
Abstract
Information
Microscopy and Microanalysis , Volume 24 , Supplement S1: Proceedings of Microscopy & Microanalysis 2018 , August 2018 , pp. 150 - 151
Copyright
© Microscopy Society of America 2018 

References

[1] Lapedus, M, Semiconductor Engineering (2018 https://semiengineering.com/nodes-vs-node-lets/.Google Scholar
[2] Mistry, K. Intel Corporation Technology and Manufacturing Day (2017).Google Scholar
[3] Feng, H., et al. Proceedings of the 40th International Symposium for Testing and Failure Analysis, (2014), p. 478.Google Scholar